发明授权
US07385202B2 Divergent charged particle implantation for improved transistor symmetry 有权
用于改善晶体管对称性的发散带电粒子注入

Divergent charged particle implantation for improved transistor symmetry
摘要:
The present invention provides a method for implanting charged particles in a substrate and a method for manufacturing an integrated circuit. The method for implanting charged particles in a substrate, among other steps, includes projecting a beam of charged particles (320) to a substrate (330), the beam of charged particles (320) having a given beam divergence, and forming a diverged beam of charged particles (360) by subjecting the beam of charged particles (320) to an energy field (350), thereby causing the beam of charged particles (320) to have a larger beam divergence. The method then desires implanting the diverged beam of charged particles (360) into the substrate (330).
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