Invention Grant
- Patent Title: Electronic packaging using conductive interproser connector
- Patent Title (中): 电子封装采用导电插头连接器
-
Application No.: US11761315Application Date: 2007-06-11
-
Publication No.: US07385288B2Publication Date: 2008-06-10
- Inventor: David W. Boggs , John H. Dungan , Frank A. Sanders , Daryl A. Sato , Dan Willis
- Applicant: David W. Boggs , John H. Dungan , Frank A. Sanders , Daryl A. Sato , Dan Willis
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/14
Abstract:
Formation of a plurality of conductive connectors of an integrated circuit package is described. The conductive connectors made with a conductive elastomer material and formed using an interposer that includes a plurality of the conductive connectors linked together.
Public/Granted literature
- US20070228562A1 ELECTRONIC PACKAGING USING CONDUCTIVE INTERPROSER CONNECTOR Public/Granted day:2007-10-04
Information query
IPC分类:
