发明授权
US07387738B2 Removal of surface oxides by electron attachment for wafer bumping applications
有权
通过电子附着去除晶片碰撞应用中的表面氧化物
- 专利标题： Removal of surface oxides by electron attachment for wafer bumping applications
- 专利标题（中）： 通过电子附着去除晶片碰撞应用中的表面氧化物
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申请号： US10425405申请日： 2003-04-28
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公开(公告)号： US07387738B2公开(公告)日： 2008-06-17
- 发明人: Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick
- 申请人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick
- 申请人地址： US PA Allentown
- 专利权人： Air Products and Chemicals, Inc.
- 当前专利权人： Air Products and Chemicals, Inc.
- 当前专利权人地址： US PA Allentown
- 代理商 Rosaleen P. Morris-Oskanian; Joseph D. Rossi
- 主分类号： B23H3/00
- IPC分类号： B23H3/00
摘要：
The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and/or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate.
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