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1.发明授权Removal of surface oxides by electron attachment for wafer bumping applications 有权通过电子附着去除晶片碰撞应用中的表面氧化物公开(公告)号：US07387738B2
公开(公告)日：2008-06-17
申请号：US10425405
申请日：2003-04-28
申请人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick
发明人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick
IPC分类号： B23H3/00
CPC分类号： H01J37/32431 , B23K1/008 , B23K1/206 , B23K35/268 , B23K35/38 , C23G5/00 , H01L21/31116 , H01L21/67069 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and/or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate.
摘要翻译： 本发明涉及从衬底表面去除金属氧化物的方法。 在一个特定实施例中，该方法包括：提供驻留在目标区域内的衬底，第一和第二电极; 将包含还原气体的气体混合物通过所述目标区域; 向第一和/或第二电极提供一定量的能量以在目标区域内产生电子，其中至少一部分电子附着到一部分还原气体并形成带负电荷的还原气体; 并使基板与带负电荷的还原气体接触以减少基板表面上的金属氧化物。
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公开(公告)号：US08617352B2
公开(公告)日：2013-12-31
申请号：US12968607
申请日：2010-12-15
申请人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick , Gary A. Orbeck , Donald A. Seccombe, Jr.
发明人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick , Gary A. Orbeck , Donald A. Seccombe, Jr.
IPC分类号： C23F1/08
CPC分类号： H01J37/32431 , B23K1/008 , B23K1/206 , B23K35/268 , B23K35/38 , C23G5/00 , H01L21/31116 , H01L21/67069 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and a method comprising same for removing metal oxides from a substrate surface are disclosed herein. In one particular embodiment, the apparatus comprises an electrode assembly that has a housing that is at least partially comprised of an insulating material and having an internal volume and at least one fluid inlet that is in fluid communication with the internal volume; a conductive base connected to the housing comprising a plurality of conductive tips that extend therefrom into a target area and a plurality of perforations that extend therethrough and are in fluid communication with the internal volume to allow for a passage of a gas mixture comprising a reducing gas.
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3.发明授权公开(公告)号：US07563380B2
公开(公告)日：2009-07-21
申请号：US10819225
申请日：2004-04-07
申请人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick , Gary A. Orbeck , Donald A. Seccombe, Jr.
发明人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick , Gary A. Orbeck , Donald A. Seccombe, Jr.
IPC分类号： B23H9/00
CPC分类号： H01J37/32431 , B23K1/008 , B23K1/206 , B23K35/268 , B23K35/38 , C23G5/00 , H01L21/31116 , H01L21/67069 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and a method comprising same for removing metal oxides from a substrate surface are disclosed herein. In one particular embodiment, the apparatus comprises an electrode assembly that has a housing that is at least partially comprised of an insulating material and having an internal volume and at least one fluid inlet that is in fluid communication with the internal volume; a conductive base connected to the housing comprising a plurality of conductive tips that extend therefrom into a target area and a plurality of perforations that extend therethrough and are in fluid communication with the internal volume to allow for a passage of a gas mixture comprising a reducing gas.
摘要翻译： 本文公开了一种用于从衬底表面去除金属氧化物的装置和方法。 在一个特定实施例中，该装置包括电极组件，该电极组件至少部分地由绝缘材料构成并具有内部容积和与内部容积流体连通的至少一个流体入口的壳体; 连接到壳体的导电基座包括从其延伸到目标区域中的多个导电尖端和穿过其延伸并与内部体积流体连通的多个穿孔，以允许包含还原气体的气体混合物通过 。
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4.发明申请公开(公告)号：US20080295966A1
公开(公告)日：2008-12-04
申请号：US12188667
申请日：2008-08-08
申请人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick , Gary A. Orbeck , Donald A. Seccombe, JR.
发明人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick , Gary A. Orbeck , Donald A. Seccombe, JR.
IPC分类号： C23F1/08
CPC分类号： H01J37/32431 , B23K1/008 , B23K1/206 , B23K35/268 , B23K35/38 , C23G5/00 , H01L21/31116 , H01L21/67069 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and a method comprising same for removing metal oxides from a substrate surface are disclosed herein. In one particular embodiment, the apparatus comprises an electrode assembly that has a housing that is at least partially comprised of an insulating material and having an internal volume and at least one fluid inlet that is in fluid communication with the internal volume; a conductive base connected to the housing comprising a plurality of conductive tips that extend therefrom into a target area and a plurality of perforations that extend therethrough and are in fluid communication with the internal volume to allow for a passage of a gas mixture comprising a reducing gas.
摘要翻译： 本文公开了一种用于从衬底表面去除金属氧化物的装置和方法。 在一个特定实施例中，该装置包括电极组件，该电极组件至少部分地由绝缘材料构成并具有内部容积和与内部容积流体连通的至少一个流体入口的壳体; 连接到壳体的导电基座包括从其延伸到目标区域中的多个导电尖端和穿过其延伸并与内部体积流体连通的多个穿孔，以允许包含还原气体的气体混合物通过 。
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5.发明申请Removal of Surface Oxides by Electron Attachment for Wafer Bumping Applications 有权通过用于晶片冲击应用的电子附件去除表面氧化物公开(公告)号：US20080149690A1
公开(公告)日：2008-06-26
申请号：US12042055
申请日：2008-03-04
申请人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick
发明人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick
IPC分类号： B23K1/20
CPC分类号： H01J37/32431 , B23K1/008 , B23K1/206 , B23K35/268 , B23K35/38 , C23G5/00 , H01L21/31116 , H01L21/67069 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and/or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate.
摘要翻译： 本发明涉及从衬底表面去除金属氧化物的方法。 在一个特定实施例中，该方法包括：提供驻留在目标区域内的衬底，第一和第二电极; 将包含还原气体的气体混合物通过所述目标区域; 向第一和/或第二电极提供一定量的能量以在目标区域内产生电子，其中至少一部分电子附着到一部分还原气体并形成带负电荷的还原气体; 并使基板与带负电荷的还原气体接触以减少基板表面上的金属氧化物。
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6.发明申请公开(公告)号：US20110094679A1
公开(公告)日：2011-04-28
申请号：US12968607
申请日：2010-12-15
申请人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick , Gary A. Orbeck , Donald A. Seccombe, JR.
发明人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick , Gary A. Orbeck , Donald A. Seccombe, JR.
IPC分类号： C23F1/08
CPC分类号： H01J37/32431 , B23K1/008 , B23K1/206 , B23K35/268 , B23K35/38 , C23G5/00 , H01L21/31116 , H01L21/67069 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and a method comprising same for removing metal oxides from a substrate surface are disclosed herein. In one particular embodiment, the apparatus comprises an electrode assembly that has a housing that is at least partially comprised of an insulating material and having an internal volume and at least one fluid inlet that is in fluid communication with the internal volume; a conductive base connected to the housing comprising a plurality of conductive tips that extend therefrom into a target area and a plurality of perforations that extend therethrough and are in fluid communication with the internal volume to allow for a passage of a gas mixture comprising a reducing gas.
摘要翻译： 本文公开了一种用于从衬底表面去除金属氧化物的装置和方法。 在一个特定实施例中，该装置包括电极组件，该电极组件至少部分地由绝缘材料构成并具有内部容积和与内部容积流体连通的至少一个流体入口的壳体; 连接到壳体的导电基座包括从其延伸到目标区域中的多个导电尖端和穿过其延伸并与内部体积流体连通的多个穿孔，以允许包含还原气体的气体混合物通过 。
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7.发明授权Removal of surface oxides by electron attachment for wafer bumping applications 有权通过电子附着去除晶片碰撞应用中的表面氧化物公开(公告)号：US08119016B2
公开(公告)日：2012-02-21
申请号：US12042055
申请日：2008-03-04
申请人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick
发明人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick
IPC分类号： B23K1/20
CPC分类号： H01J37/32431 , B23K1/008 , B23K1/206 , B23K35/268 , B23K35/38 , C23G5/00 , H01L21/31116 , H01L21/67069 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and/or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate.
摘要翻译： 本发明涉及从衬底表面去除金属氧化物的方法。 在一个特定实施例中，该方法包括：提供驻留在目标区域内的衬底，第一和第二电极; 将包含还原气体的气体混合物通过所述目标区域; 向第一和/或第二电极提供一定量的能量以在目标区域内产生电子，其中至少一部分电子附着到一部分还原气体并形成带负电荷的还原气体; 并使基板与带负电荷的还原气体接触以减少基板表面上的金属氧化物。
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8.发明授权公开(公告)号：US07883602B2
公开(公告)日：2011-02-08
申请号：US12188667
申请日：2008-08-08
申请人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick , Gary A. Orbeck , Donald A. Seccombe, Jr.
发明人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick , Gary A. Orbeck , Donald A. Seccombe, Jr.
CPC分类号： H01J37/32431 , B23K1/008 , B23K1/206 , B23K35/268 , B23K35/38 , C23G5/00 , H01L21/31116 , H01L21/67069 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and a method comprising same for removing metal oxides from a substrate surface are disclosed herein. In one particular embodiment, the apparatus comprises an electrode assembly that has a housing that is at least partially comprised of an insulating material and having an internal volume and at least one fluid inlet that is in fluid communication with the internal volume; a conductive base connected to the housing comprising a plurality of conductive tips that extend therefrom into a target area and a plurality of perforations that extend therethrough and are in fluid communication with the internal volume to allow for a passage of a gas mixture comprising a reducing gas.
摘要翻译： 本文公开了一种用于从衬底表面去除金属氧化物的装置和方法。 在一个特定实施例中，该装置包括电极组件，该电极组件至少部分地由绝缘材料构成并具有内部容积和与内部容积流体连通的至少一个流体入口的壳体; 连接到壳体的导电基座包括从其延伸到目标区域中的多个导电尖端和穿过其延伸并与内部体积流体连通的多个穿孔，以允许包含还原气体的气体混合物通过 。
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公开(公告)号：US20090223831A1
公开(公告)日：2009-09-10
申请号：US12119701
申请日：2008-05-13
IPC分类号： C25F5/00
CPC分类号： B23K1/008 , B23K1/206 , B23K35/268 , B23K35/38 , C23G5/00 , H01J37/32431 , H01L21/31116 , H01L21/67069 , H05K3/3489 , H05K2203/087 , H05K2203/105 , H05K2203/1157
摘要： The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and/or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate.
摘要翻译： 本发明涉及从衬底表面去除金属氧化物的方法。 在一个特定实施例中，该方法包括：提供驻留在目标区域内的衬底，第一和第二电极; 将包含还原气体的气体混合物通过所述目标区域; 向第一和/或第二电极提供一定量的能量以在目标区域内产生电子，其中至少一部分电子附着到一部分还原气体并形成带负电荷的还原气体; 并使基板与带负电荷的还原气体接触以减少基板表面上的金属氧化物。
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10.发明申请Apparatus for Removal of Surface Oxides via Fluxless Technique Involving Electron Attachment and Remote Ion Generation 有权用于通过无电极技术去除表面氧化物的装置，涉及电子附件和远程离子生成公开(公告)号：US20110229377A1
公开(公告)日：2011-09-22
申请号：US13151883
申请日：2011-06-02
IPC分类号： B01J19/08
CPC分类号： C23G5/00 , B08B7/00 , B23K1/0016 , B23K1/008 , B23K1/012 , B23K1/206 , H05K3/3489 , H05K2203/095
摘要： The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing a component on a substrate wherein the substrate is grounded or has a positive electrical potential to form a target assembly; passing a gas mixture comprising a reducing gas through an ion generator comprising a first and a second electrode; supplying an amount of voltage to at least one of the first and second electrodes sufficient to generate electrons wherein the electrons attach to at least a portion of the reducing gas and form a negatively charged reducing gas; and contacting the target assembly with the negatively charged reducing gas to reduce the oxides on the component.
摘要翻译： 本发明提供了一种用于通过电子附件干燥熔化至少一种组分和/或焊料表面的方法和装置。 在一个实施方案中，提供了从组分表面去除氧化物的方法，包括：在基底上提供组分，其中所述基底接地或具有正电位以形成靶组件; 使包含还原气体的气体混合物通过包括第一和第二电极的离子发生器; 向所述第一和第二电极中的至少一个电极供应足以产生电子的电压，其中所述电子附着到所述还原气体的至少一部分并形成带负电荷的还原气体; 并将目标组件与带负电荷的还原气体接触以减少部件上的氧化物。
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