Invention Grant
- Patent Title: Method and system for vertical optical coupling on semiconductor substrate
- Patent Title (中): 半导体衬底垂直光耦合方法及系统
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Application No.: US10955891Application Date: 2004-09-30
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Publication No.: US07389013B2Publication Date: 2008-06-17
- Inventor: Ming Fang , Larry R. Tullos , Hai Ding
- Applicant: Ming Fang , Larry R. Tullos , Hai Ding
- Applicant Address: US TX Carrollton
- Assignee: STMicroelectronics, Inc.
- Current Assignee: STMicroelectronics, Inc.
- Current Assignee Address: US TX Carrollton
- Agent Lisa K. Jorgenson; David V. Carlson
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/124 ; G02B6/00

Abstract:
Connection between optical fibers and optical components within a semiconductor substrate. A lens is created at the front of a semiconductor substrate. A tapered hole is created in the back of the substrate exposing part or all of the surface of the lens. An optical component is formed or affixed at the front surface of the substrate. A volume of transparent adhesive is placed in the hole, followed by an optical fiber, which is thus coupled to the surface of the lens. A light guide is created on the front of the substrate overlying the lens to direct optical signals between the optical fiber inserted in the tapered hole and the optical component on the surface of the substrate.
Public/Granted literature
- US20060067607A1 Method and system for vertical optical coupling on semiconductor substrate Public/Granted day:2006-03-30
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