公开(公告)号：US07389013B2

公开(公告)日：2008-06-17

申请号：US10955891

申请日：2004-09-30

申请人： Ming Fang ,  Larry R. Tullos ,  Hai Ding

发明人： Ming Fang ,  Larry R. Tullos ,  Hai Ding

IPC分类号： G02B6/12 ,  G02B6/124 ,  G02B6/00

CPC分类号： G02B6/4204 ,  G02B6/4214

摘要： Connection between optical fibers and optical components within a semiconductor substrate. A lens is created at the front of a semiconductor substrate. A tapered hole is created in the back of the substrate exposing part or all of the surface of the lens. An optical component is formed or affixed at the front surface of the substrate. A volume of transparent adhesive is placed in the hole, followed by an optical fiber, which is thus coupled to the surface of the lens. A light guide is created on the front of the substrate overlying the lens to direct optical signals between the optical fiber inserted in the tapered hole and the optical component on the surface of the substrate.

摘要翻译： 半导体衬底内的光纤和光学部件之间的连接。 在半导体基板的前面形成透镜。 在基板的背面产生露出透镜的一部分或全部表面的锥形孔。 在基板的前表面上形成或固定光学部件。 将一定体积的透明粘合剂放置在孔中，随后是光纤，其由此耦合到透镜的表面。 在衬底的前面形成一个导光体，该导光体覆盖在透镜上，以将插入锥形孔中的光纤与基片表面上的光学部件之间的光信号引导。