发明授权
- 专利标题： Method and composition for electrochemical mechanical polishing processing
- 专利标题（中）： 电化学机械抛光加工的方法和组成
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申请号： US11312823申请日： 2005-12-19
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公开(公告)号： US07390429B2公开(公告)日： 2008-06-24
- 发明人: Feng Q. Liu , Tianbao Du , Alain Duboust , Wei-Yung Hsu
- 申请人： Feng Q. Liu , Tianbao Du , Alain Duboust , Wei-Yung Hsu
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Patterson & Sheridan
- 主分类号： C09K13/00
- IPC分类号： C09K13/00 ; C09K13/04 ; C09K13/06
摘要：
A method of processing a substrate having a conductive material layer disposed thereon is provided which includes positioning the substrate in a process apparatus and supplying a first polishing composition between to the substrate. The polishing composition comprises a first chelating agent, a second chelating agent, a first corrosion inhibitor, a second corrosion inhibitor, a suppressor, a solvent, and an inorganic acid based electrolyte to provide a pH between about 3 and about 10.
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