Invention Grant
- Patent Title: Encapsulated organic semiconductor device and method
- Patent Title (中): 封装有机半导体器件及方法
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Application No.: US11108025Application Date: 2005-04-15
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Publication No.: US07393716B2Publication Date: 2008-07-01
- Inventor: Steven Scheifers , Daniel Gamota , Andrew Skipor , Krishna Kalyanasundaram
- Applicant: Steven Scheifers , Daniel Gamota , Andrew Skipor , Krishna Kalyanasundaram
- Applicant Address: US IL Schaumburg
- Assignee: Motorola, Inc.
- Current Assignee: Motorola, Inc.
- Current Assignee Address: US IL Schaumburg
- Main IPC: H01L51/00
- IPC: H01L51/00 ; H01L21/00 ; H01L29/08 ; H01L35/24

Abstract:
A semiconductor device comprising organic semiconductor material (14) has one or more barrier layers (16) disposed at least partially thereabout to protect the organic semiconductor material (14) from environment-driven changes that typically lead to inoperability of a corresponding device. If desired, the barrier layer can be comprised of partially permeable material that allows some substances therethrough to thereby effect disabling of the encapsulated organic semiconductor device after a substantially predetermined period of time. Getterers (141) may also be used to protect, at least for a period of time, such organic semiconductor material.
Public/Granted literature
- US20050189537A1 Encapsulated organic semiconductor device and method Public/Granted day:2005-09-01
Information query
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