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    High energy soldering composition and method of soldering
    1.
    发明申请
    High energy soldering composition and method of soldering 审中-公开
    高能焊料组合物及焊接方法

    公开(公告)号：US20060196579A1

    公开(公告)日：2006-09-07

    申请号：US11073919

    申请日：2005-03-07

    Applicant: Andrew Skipor ,  Krishna Jonnalagadda ,  Steven Scheifers

    Inventor： Andrew Skipor ,  Krishna Jonnalagadda ,  Steven Scheifers

    IPC: B23K35/34

    CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  H05K2201/0257 ,  H05K2201/0266

    Abstract: A low temperature, high energy soldering composition for joining metals together contains a fluxing agent and high energy metal particles that possess sufficiently high internal energy, suspended in the fluxing agent, such that the melting point of the high energy metal particles is depressed by at least three degrees Celsius below the normal bulk melting temperature of metal. A solder joint is effected by placing the high energy metal particles in contact with one or more of the metal surfaces and heating the high energy metal particles in the presence of a fluxing agent to melt the high energy metal particles and fuse them to the metal surface.

    Abstract translation: 用于将金属接合的低温，高能量焊接组合物含有助熔剂和具有足够高的内部能量的高能金属颗粒，悬浮在助熔剂中，使得高能金属颗粒的熔点至少被压下 三摄氏度以下的正常体积熔融金属温度。 通过将高能金属颗粒与一个或多个金属表面接触并且在助熔剂存在下加热高能金属颗粒来熔化高能金属颗粒并将其熔合到金属表面来实现焊接接头 。

    APPARATUS FOR SELECTIVELY BACKLIGHTING A MATERIAL
    3.
    发明申请
    APPARATUS FOR SELECTIVELY BACKLIGHTING A MATERIAL 有权
    选择材料选择的装置

    公开(公告)号：US20090059554A1

    公开(公告)日：2009-03-05

    申请号：US11846360

    申请日：2007-08-28

    Applicant: Andrew Skipor ,  Rick Latella ,  Steven Scheifers

    Inventor： Andrew Skipor ,  Rick Latella ,  Steven Scheifers

    IPC: F21V9/16 ,  F21V9/08 ,  G01D11/28

    CPC classification number: G06F1/3218 ,  G02F1/1336 ,  G02F1/133617 ,  G02F2001/133614 ,  H01H13/83 ,  H01H2219/018 ,  H01H2219/052

    Abstract: A backlighting device (300, 400, 500, 600) emitting light having a first wavelength includes a first radiation emission device (302), e.g., an electroluminescent lamp, for emitting radiation having a second wavelength. A layer (306) of a plurality of photon emitting particles (308), e.g., free standing quantum dots or phosphorus particles, emits light having the first wavelength in response to the first radiation emission device (302), the first wavelength being larger than the second wavelength. A transparent material (116, 120, 122) overlies the layer of a plurality of photon emitting particles (308), wherein the light having a first wavelength passes through the transparent material (116, 120, 122). Optionally, a filter (402) may be placed over the layer (306) to block the radiation having a second wavelength, and a scattering layer (604) may be placed over the layer (306) to scatter wavelength other than the first wavelength.

    Abstract translation: 发射具有第一波长的光的背光装置（300,400,500,600）包括用于发射具有第二波长的辐射的第一辐射发射装置（302），例如电致发光灯。 多个光子发射粒子（308）的层（306）（例如，独立量子点或磷粒子）响应于第一辐射发射装置（302）发射具有第一波长的光，第一波长大于 第二波长。 透明材料（116,120,122）覆盖多个光子发射颗粒（308）的层，其中具有第一波长的光通过透明材料（116,120,122）。 可选地，过滤器（402）可以放置在层（306）上以阻挡具有第二波长的辐射，并且可以在层（306）上方布置散射层（604）以散射除第一波长之外的波长。

    Method for determining chemical content of complex structures using X-ray microanalysis
    4.
    发明申请
    Method for determining chemical content of complex structures using X-ray microanalysis 失效
    使用X射线微量分析法确定复合结构的化学成分的方法

    公开(公告)号：US20060115042A1

    公开(公告)日：2006-06-01

    申请号：US10999083

    申请日：2004-11-29

    Applicant: Michael Riess ,  Steven Scheifers ,  William Olson

    Inventor： Michael Riess ,  Steven Scheifers ,  William Olson

    IPC: G01N23/223 ,  G01T1/36

    CPC classification number: H05K3/00 ,  G01N23/06 ,  G01N23/223 ,  G01N2223/076 ,  H05K2203/162

    Abstract: A method for identifying hazardous substances in a printed wiring assembly having a plurality of discrete components, using micro X-ray fluorescence spectroscopy. A micro X-ray fluorescence spectroscopy (μ-XRF) and/or X-ray Absorption Fine Structure (XAFS) spectroscopy are used as detecting analyzers, to identify materials of concern in an electronic device. The device or assembly to be examined is analyzed by moving it in the X, Y, and Z directions under a probe in response to information in a reference database, to determine elemental composition at selected locations on the assembly, the probe positioned at an optimum analytical distance from each selected location for analysis. The determined elemental composition at each selected location is then correlated to the reference database, and the detected elements are assigned to the various components in the assembly.

    Abstract translation: 一种使用微X射线荧光光谱法鉴定具有多个分立元件的印刷线路组件中的有害物质的方法。 使用微X射线荧光光谱（μ-XRF）和/或X射线吸收精细结构（XAFS）光谱作为检测分析仪，以识别电子设备中关注的材料。 要检查的设备或组件是通过在探针下在X，Y和Z方向上移动来响应于参考数据库中的信息来分析的，以确定组件上选定位置处的元素组成，探针定位在最佳状态 从每个选定位置的分析距离进行分析。 然后将确定的每个选定位置的元素组成与参考数据库相关联，并将检测到的元素分配给组件中的各种组件。

    Recycling compatible hard coating
    6.
    发明申请
    Recycling compatible hard coating 审中-公开
    回收兼容硬涂层

    公开(公告)号：US20070048526A1

    公开(公告)日：2007-03-01

    申请号：US11215917

    申请日：2005-08-31

    Applicant: William Hoffman ,  Steven Scheifers ,  Doreen Schnecke

    Inventor： William Hoffman ,  Steven Scheifers ,  Doreen Schnecke

    IPC: B32B27/36

    CPC classification number: C08J7/06 ,  B29B17/04 ,  B29L2031/445 ,  B29L2031/768 ,  C08G18/3215 ,  C08G18/3221 ,  C08G18/3228 ,  C08G18/3243 ,  C08G18/7657 ,  C08J11/06 ,  C08J2375/04 ,  C09D175/04 ,  Y02W30/625 ,  Y02W30/701 ,  Y10T428/31507

    Abstract: A recyclable plastic article having a scratch resistant coating. An injection molded thermoplastic article is coated with a polymeric or inorganic coating so as to enable the coating to be compatible with the thermoplastic during the recycling process. The polymeric hard coat contains functional chemical groups that interact with the underlying thermoplastic resin to render the coating miscible with the thermoplastic resin when the recyclable plastic article is ground, pelletized and molded. After the typical recycling process of grinding, pelletizing, and molding, the thermoplastic resin retains at least 95% of the original mechanical properties of the virgin resin. Compatibilization agents and other processing steps are not needed to insure proper recycling.

    Abstract translation: 具有耐刮擦涂层的可回收塑料制品。 注射成型的热塑性制品被涂覆有聚合物或无机涂层，以使涂层在再循环过程中与热塑性塑料相容。 聚合物硬涂层含有与底层热塑性树脂相互作用的功能性化学基团，以使可涂覆的塑料制品被研磨，造粒和模塑时使涂层与热塑性树脂混溶。 在经过典型的研磨，造粒和模塑回收处理之后，热塑性树脂保留了原始树脂的原始机械性能的至少95％。 不需要增容剂和其他加工步骤来确保适当的回收利用。

    APPARATUS FOR SELECTIVELY BACKLIGHTING A MATERIAL
    7.
    发明申请
    APPARATUS FOR SELECTIVELY BACKLIGHTING A MATERIAL 审中-公开
    选择材料选择的装置

    公开(公告)号：US20120195022A1

    公开(公告)日：2012-08-02

    申请号：US13367149

    申请日：2012-02-06

    Applicant: Andrew Skipor ,  Rick Latella ,  Steven Scheifers

    Inventor： Andrew Skipor ,  Rick Latella ,  Steven Scheifers

    IPC: F21V9/16

    CPC classification number: G06F1/3218 ,  G02F1/1336 ,  G02F1/133617 ,  G02F2001/133614 ,  H01H13/83 ,  H01H2219/018 ,  H01H2219/052

    Abstract: A backlighting device (300, 400, 500, 600) emitting light having a first wavelength includes a first radiation emission device (302), e.g., an electroluminescent lamp, for emitting radiation having a second wavelength. A layer (306) of a plurality of photon emitting particles (308), e.g., free standing quantum dots or phosphorus particles, emits light having the first wavelength in response to the first radiation emission device (302), the first wavelength being larger than the second wavelength. A transparent material (116, 120, 122) overlies the layer of a plurality of photon emitting particles (308), wherein the light having a first wavelength passes through the transparent material (116, 120, 122). Optionally, a filter (402) may be placed over the layer (306) to block the radiation having a second wavelength, and a scattering layer (604) may be placed over the layer (306) to scatter wavelength other than the first wavelength.

    Abstract translation: 发射具有第一波长的光的背光装置（300,400,500,600）包括用于发射具有第二波长的辐射的第一辐射发射装置（302），例如电致发光灯。 多个光子发射粒子（308）的层（306）（例如，独立量子点或磷粒子）响应于第一辐射发射装置（302）发射具有第一波长的光，第一波长大于 第二波长。 透明材料（116,120,122）覆盖多个光子发射颗粒（308）的层，其中具有第一波长的光通过透明材料（116,120,122）。 可选地，过滤器（402）可以放置在层（306）上以阻挡具有第二波长的辐射，并且可以在层（306）上方布置散射层（604）以散射除第一波长之外的波长。

    Encapsulated organic semiconductor device and method
    8.
    发明申请
    Encapsulated organic semiconductor device and method 有权
    封装有机半导体器件及方法

    公开(公告)号：US20050189537A1

    公开(公告)日：2005-09-01

    申请号：US11108025

    申请日：2005-04-15

    Applicant: Steven Scheifers ,  Daniel Gamota ,  Andrew Skipor ,  Krishna Kalyanasundaram

    Inventor： Steven Scheifers ,  Daniel Gamota ,  Andrew Skipor ,  Krishna Kalyanasundaram

    IPC: H01L51/05 ,  H01L51/52 ,  H01L29/08 ,  H01L21/8234 ,  H01L35/24 ,  H01L51/00

    CPC classification number: H01L51/107 ,  H01L51/0516 ,  H01L51/524 ,  H01L51/5243 ,  H01L51/5253 ,  H01L51/5259 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A semiconductor device comprising organic semiconductor material (14) has one or more barrier layers (16) disposed at least partially thereabout to protect the organic semiconductor material (14) from environment-driven changes that typically lead to inoperability of a corresponding device. If desired, the barrier layer can be comprised of partially permeable material that allows some substances therethrough to thereby effect disabling of the encapsulated organic semiconductor device after a substantially predetermined period of time. Getterers (141) may also be used to protect, at least for a period of time, such organic semiconductor material.

    Abstract translation: 包括有机半导体材料（14）的半导体器件具有至少部分设置在其周围的一个或多个阻挡层（16），以保护有机半导体材料（14）免受通常导致相应器件的不可操作性的环境驱动的变化。 如果需要，阻挡层可以由允许一些物质通过其的部分渗透性材料构成，从而在基本上预定的时间段之后使封装的有机半导体器件失效。 乞丐（141）也可用于至少在一段时间内保护这种有机半导体材料。

    Noncollapsing multisolder interconnection
    9.
    发明授权
    Noncollapsing multisolder interconnection 失效
    非聚合多金属互连

    公开(公告)号：US5154341A

    公开(公告)日：1992-10-13

    申请号：US622996

    申请日：1990-12-06

    Applicant: Cynthia M. Melton ,  Carl J. Raleigh ,  Steven Scheifers

    Inventor： Cynthia M. Melton ,  Carl J. Raleigh ,  Steven Scheifers

    IPC: H01L23/498 ,  H05K3/34

    CPC classification number: H01L23/49827 ,  H05K3/3436 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2201/2036 ,  Y02P70/613

    Abstract: An improved electrical component package comprises a component attached to a substrate by a plurality of multisolder interconnections. Each interconnection comprises a preformed spacer bump composed of a first solder alloy, preferably a lead-base tin alloy containing greater than 90 weight percent lead. The spacer bump is bonded to a metallic electrical contact of the component and rests against a corresponding metallic electrical contact of the substrate, but is not directly metallurgically bonded thereto. Each interconnection further comprises a sheath portion formed of a second compositionally distinct solder alloy having a liquidus temperature less than the first alloy solidus temperature. A preferred second solder is a tin-lead alloy comprising between about 30 and 50 weight percent lead and the balance tin or indium. The sheath is bonded to the spacer bump and to the substrate contact to complete attachment of the component to the substrate and preferably extends to the component contact, encasing the bump, to produce an interconnection having an hour glass configuration to reduce thermal fatigue stresses at the solder bonds to the contacts. A method for forming the multisolder interconnection is presented wherein the sheath is derived from a solder microball situated on the substrate contact in juxtaposition to the spacer bump for reflow.

    Abstract translation: 改进的电子部件封装包括通过多个多金属互连连接到基板的部件。 每个互连包括由第一焊料合金构成的预制间隔凸块，优选含有大于90重量％铅的铅基锡合金。 间隔凸块接合到部件的金属电接触件上，并抵靠基板的相应的金属电接触件，但不直接冶金结合到其上。 每个互连还包括由液态温度小于第一合金固相线温度的第二组成不同的焊料合金形成的护套部分。 优选的第二焊料是锡铅合金，其包含约30至50重量％的铅和余量的锡或铟。 护套结合到间隔件凸块和衬底接触件以完成组件到衬底的附接，并且优选地延伸到组件接触件，包住凸块，以产生具有小时玻璃构造的互连，以减少在 焊接到触点。 提出了一种用于形成多金属互连的方法，其中所述护套从位于所述衬底触点上的焊料微球导出并置到用于回流的间隔件凸块。

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