Invention Grant
- Patent Title: Flexible circuit substrate for flip-chip-on-flex applications
- Patent Title (中): 柔性电路基板，用于倒装芯片上的柔性应用
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Application No.: US11360200Application Date: 2006-02-23
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Publication No.: US07394028B2Publication Date: 2008-07-01
- Inventor: Charles Cohn
- Applicant: Charles Cohn
- Applicant Address: US PA Allentown
- Assignee: Agere Systems Inc.
- Current Assignee: Agere Systems Inc.
- Current Assignee Address: US PA Allentown
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01R9/09
Abstract:
A circuit substrate for attachment to an integrated circuit chip comprises an electrical trace, a mounting pad and a dielectric layer. The mounting pad has a first surface, one or more sidewalls and a second surface. The first surface is attached to the electrical trace. The dielectric layer substantially covers the one or more sidewalls of the mounting pad and has an uppermost surface that is substantially coplanar with the second surface of the mounting pad.
Public/Granted literature
- US20070194456A1 Flexible circuit substrate for flip-chip-on-flex applications Public/Granted day:2007-08-23
Information query
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