公开(公告)号：US08601683B2

公开(公告)日：2013-12-10

申请号：US11379256

申请日：2006-04-19

申请人： Charles Cohn ,  Jeffrey M Klemovage

发明人： Charles Cohn ,  Jeffrey M Klemovage

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： H05K3/4046 ,  H05K2201/10287 ,  H05K2201/10416 ,  Y10T29/49124 ,  Y10T29/49155

摘要： The present invention provides method of manufacture for a printed wiring board. The printed wiring board constructed according to the teachings of the present invention includes a printed wiring board dielectric layer having conductive foils located on at least two sides thereof. The printed wiring board further includes a solid core conductive material interconnecting the conductive foils.

摘要翻译： 本发明提供一种印刷线路板的制造方法。 根据本发明的教导构造的印刷线路板包括具有位于其至少两侧的导电箔的印刷线路板电介质层。 印刷线路板还包括将导电箔互连的固体芯导电材料。

公开(公告)号：US07445638B2

公开(公告)日：2008-11-04

申请号：US11071540

申请日：2005-03-03

申请人： Laurent Beguin ,  Denis Bouttens ,  Charles Cohn ,  Geert Declercq ,  Yann Brunnarius ,  Jean Grimberg ,  Dominique Huguet ,  Eric Lesprit ,  Pierre Massart ,  Bruno Rio ,  Jacques Teissier ,  Bruno Toussaint ,  Bruno Zipoli

发明人： Laurent Beguin ,  Denis Bouttens ,  Charles Cohn ,  Geert Declercq ,  Yann Brunnarius ,  Jean Grimberg ,  Dominique Huguet ,  Eric Lesprit ,  Pierre Massart ,  Bruno Rio ,  Jacques Teissier ,  Bruno Toussaint ,  Bruno Zipoli

IPC分类号： A61F2/40 ,  A61F2/30

CPC分类号： A61F2/4014 ,  A61F2/4059 ,  A61F2002/30332 ,  A61F2002/30405 ,  A61F2002/305 ,  A61F2002/30537 ,  A61F2002/3054 ,  A61F2002/30594 ,  A61F2002/30607 ,  A61F2002/3082 ,  A61F2002/4037 ,  A61F2002/4044 ,  A61F2220/0025 ,  A61F2220/0033 ,  A61F2250/0004 ,  A61F2250/0062 ,  A61F2310/00017 ,  A61F2310/00029

摘要： This adaptable humeral implant comprises an anchoring stem (1, 8) and a male insert (6) or a female insert (30, 31) which are able to cooperate with the glenoid cavity or a glenoid implant. It additionally comprises a removable support (5) intended to fit directly or indirectly to the upper end (3) of the anchoring stem (1, 8) and to cooperate with an intermediate neck (7), which is itself provided with means for cooperation with the male or female implant.

摘要翻译： 这种适应性肱骨植入物包括能够与关节盂腔或关节盂植入物配合的锚固杆（1,8）和阳插入件（6）或阴插入件（30,31）。 它还包括一个可拆卸的支撑件（5），用于直接地或间接地配合到锚固杆（1,8）的上端（3）并与中间颈部（7）配合，该中间颈部本身设有用于配合的装置 与雄性或雌性植入物。

公开(公告)号：US20070194456A1

公开(公告)日：2007-08-23

申请号：US11360200

申请日：2006-02-23

申请人： Charles Cohn

发明人： Charles Cohn

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H05K1/111 ,  H01L23/49811 ,  H01L23/4985 ,  H01L2224/16225 ,  H05K1/0204 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/064 ,  H05K3/202 ,  H05K3/243 ,  H05K3/3452 ,  H05K3/4007 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0376 ,  H05K2201/09881 ,  H05K2201/10674 ,  H05K2203/016 ,  H05K2203/0376 ,  Y02P70/611

摘要： A circuit substrate for attachment to an integrated circuit chip comprises an electrical trace, a mounting pad and a dielectric layer. The mounting pad has a first surface, one or more sidewalls and a second surface. The first surface is attached to the electrical trace. The dielectric layer substantially covers the one or more sidewalls of the mounting pad and has an uppermost surface that is substantially coplanar with the second surface of the mounting pad.

摘要翻译： 用于附接到集成电路芯片的电路基板包括电迹线，安装焊盘和介电层。 安装垫具有第一表面，一个或多个侧壁和第二表面。 第一个表面附着在电气痕迹上。 电介质层基本上覆盖安装焊盘的一个或多个侧壁，并且具有与安装焊盘的第二表面基本共面的最上表面。

公开(公告)号：US20060200249A1

公开(公告)日：2006-09-07

申请号：US11071540

申请日：2005-03-03

申请人： Laurent Beguin ,  Denis Bouttens ,  Charles Cohn ,  Geert Declercq ,  Yann Brunnarius ,  Jean Grimberg ,  Dominique Huguet ,  Eric Lesprit ,  Pierre Massart ,  Bruno Rio ,  Jacques Teissier ,  Bruno Toussaint ,  Bruno Zipoli

发明人： Laurent Beguin ,  Denis Bouttens ,  Charles Cohn ,  Geert Declercq ,  Yann Brunnarius ,  Jean Grimberg ,  Dominique Huguet ,  Eric Lesprit ,  Pierre Massart ,  Bruno Rio ,  Jacques Teissier ,  Bruno Toussaint ,  Bruno Zipoli

IPC分类号： A61F2/40

CPC分类号： A61F2/4014 ,  A61F2/4059 ,  A61F2002/30332 ,  A61F2002/30405 ,  A61F2002/305 ,  A61F2002/30537 ,  A61F2002/3054 ,  A61F2002/30594 ,  A61F2002/30607 ,  A61F2002/3082 ,  A61F2002/4037 ,  A61F2002/4044 ,  A61F2220/0025 ,  A61F2220/0033 ,  A61F2250/0004 ,  A61F2250/0062 ,  A61F2310/00017 ,  A61F2310/00029

摘要： This adaptable humeral implant comprises an anchoring stem (1, 8) and a male insert (6) or a female insert (30, 31) which are able to cooperate with the glenoid cavity or a glenoid implant. It additionally comprises a removable support (5) intended to fit directly or indirectly to the upper end (3) of the anchoring stem (1, 8) and to cooperate with an intermediate neck (7), which is itself provided with means for cooperation with the male or female implant.

摘要翻译： 这种适应性肱骨植入物包括能够与关节盂腔或关节盂植入物配合的锚固杆（1,8）和阳插入件（6）或阴插入件（30,31）。 它还包括一个可拆卸的支撑件（5），用于直接地或间接地配合到锚固杆（1,8）的上端（3）并与中间颈部（7）配合，该中间颈部本身设有用于配合的装置 与雄性或雌性植入物。

公开(公告)号：US5102829A

公开(公告)日：1992-04-07

申请号：US733542

申请日：1991-07-22

申请人： Charles Cohn

发明人： Charles Cohn

IPC分类号： H01L23/12 ,  H01L23/24 ,  H01L23/36 ,  H01L23/498 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46

CPC分类号： H01L23/49827 ,  H01L23/24 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/0201 ,  H05K1/182 ,  H05K3/4641 ,  Y10T29/49139

摘要： This invention is a simple and effective process of producing a plastic pin grid array package having an encapsulated device and a heat sink forming a unitary component of a main planar body of the package. The process includes fabrication of a laminated planar main body having outer plastic sheets provided with metallizations, a metal sheet of high thermal conductivity, and plastic sheets positioned intermediate the outer plastic sheets and the metal sheet, the metal sheet having clearance holes filled with plugs of the material of the intermediate plastic sheets, a plurality of plated-through holes (PTHs) formed in the main body and terminal pins secured in the PTHs. Some of the PTHs contacting the metal sheet and some passing through the plugs in the clearance holes out of contact with the metal sheet. The device, such as an integrated circuit chip, mounted in a recessed cavity in the main body, is in contact with the metal heat-sink. In this manner heat is conducted away from the device by the heat sink and dissipated through the back of the package and those of the terminal pins which are in PTHs contacting the heat sink.

公开(公告)号：US20140108048A1

公开(公告)日：2014-04-17

申请号：US14044489

申请日：2013-10-02

申请人： Steven Charles Cohn

发明人： Steven Charles Cohn

IPC分类号： G06F19/00

CPC分类号： G16H10/60 ,  G06Q50/24

摘要： Embodiments described herein include generating a navigable medical history corresponding to a patient. Reference information related to medical records for the patient is stored in a referenced records database based on a standardized healthcare code in the medical records. The reference information is inserted into the referenced records database by the medical history system. The medical history system generates the navigable medical history associated with the patient based on the reference information.

摘要翻译： 本文描述的实施例包括产生对应于患者的可导航病史。 与患者医疗记录相关的参考信息基于医疗记录中的标准化医疗保健代码存储在参考记录数据库中。 参考信息由病史系统插入到引用的记录数据库中。 病历系统基于参考信息产生与患者相关联的可导航病史。

公开(公告)号：US20110010195A1

公开(公告)日：2011-01-13

申请号：US12499468

申请日：2009-07-08

申请人： Steven Charles Cohn

发明人： Steven Charles Cohn

IPC分类号： G06Q50/00 ,  G06F17/30 ,  G06Q10/00

CPC分类号： G16H10/60 ,  G06Q50/24

摘要： Embodiments described herein include generating a navigable medical history corresponding to a patient. Reference information related to medical records for the patient is stored in a referenced records database based on a standardized healthcare code in the medical records. The reference information is inserted into the referenced records database by the medical history system. The medical history system generates the navigable medical history associated with the patient based on the reference information.

摘要翻译： 本文描述的实施例包括产生对应于患者的可导航病史。 与患者医疗记录相关的参考信息基于医疗记录中的标准化医疗保健代码存储在参考记录数据库中。 参考信息由病史系统插入到引用的记录数据库中。 病历系统基于参考信息产生与患者相关联的可导航病史。

公开(公告)号：US20060175081A1

公开(公告)日：2006-08-10

申请号：US11379256

申请日：2006-04-19

申请人： Charles Cohn ,  Jeffrey Klemovage

发明人： Charles Cohn ,  Jeffrey Klemovage

IPC分类号： H05K1/00 ,  H05K3/10

CPC分类号： H05K3/4046 ,  H05K2201/10287 ,  H05K2201/10416 ,  Y10T29/49124 ,  Y10T29/49155

摘要： The present invention provides a printed wiring board and a method of manufacture therefor. The printed wiring board constructed according to the teachings of the present invention includes a printed wiring board dielectric layer having conductive foils located on at least two sides thereof. The printed wiring board further includes a solid core conductive material interconnecting the conductive foils.

摘要翻译： 本发明提供一种印刷线路板及其制造方法。 根据本发明的教导构造的印刷线路板包括具有位于其至少两侧的导电箔的印刷线路板电介质层。 印刷线路板还包括将导电箔互连的固体芯导电材料。

公开(公告)号：US20050150682A1

公开(公告)日：2005-07-14

申请号：US10755616

申请日：2004-01-12

申请人： Charles Cohn ,  Jeffrey Klemovage

发明人： Charles Cohn ,  Jeffrey Klemovage

IPC分类号： H05K3/40 ,  H05K1/09 ,  H05K1/11

CPC分类号： H05K3/4046 ,  H05K2201/10287 ,  H05K2201/10416 ,  Y10T29/49124 ,  Y10T29/49155

摘要： The present invention provides a printed wiring board and a method of manufacture therefor. The printed wiring board constructed according to the teachings of the present invention includes a printed wiring board dielectric layer having conductive foils located on at least two sides thereof. The printed wiring board further includes a solid core conductive material interconnecting the conductive foils.

摘要翻译： 本发明提供一种印刷线路板及其制造方法。 根据本发明的教导构造的印刷线路板包括具有位于其至少两侧的导电箔的印刷线路板电介质层。 印刷线路板还包括将导电箔互连的固体芯导电材料。

公开(公告)号：US06465882B1

公开(公告)日：2002-10-15

申请号：US09620939

申请日：2000-07-21

申请人： Charles Cohn ,  Donald Earl Hawk, Jr.

发明人： Charles Cohn ,  Donald Earl Hawk, Jr.

IPC分类号： H01L2352

CPC分类号： H01L24/49 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48235 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An integrated circuit package such as a BGA package for use with an integrated circuit chip. The integrated circuit package has substrate with a cavity that exposes a lower conductive level in the package so that connections between the integrated circuit chip and the lower conductive level may be formed to reduce the through holes formed in the substrate. As a result, additional signal line interconnections may be included in the substrate circuit package and/or the size of the integrated circuit chip may be decreased. Each of these may be implemented for enhanced electrical performance. The multiple wire bonding tiers in the substrate may also provide greater wire separation that eases wire bonding and subsequent encapsulation processes.

摘要翻译： 集成电路封装，例如与集成电路芯片一起使用的BGA封装。 集成电路封装具有具有在封装中暴露较低导电水平的空腔的衬底，使得可以形成集成电路芯片与下导电电平之间的连接，以减少形成在衬底中的通孔。 结果，附加的信号线互连可以包括在衬底电路封装中，和/或可以减小集成电路芯片的尺寸。 这些中的每一个可以被实现以增强电气性能。 衬底中的多引线键合层还可以提供更大的导线分离，从而简化引线键合和随后的封装工艺。