Invention Grant
- Patent Title: Thermal interface apparatus, systems, and methods
- Patent Title (中): 热接口设备，系统和方法
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Application No.: US10458603Application Date: 2003-06-10
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Publication No.: US07400040B2Publication Date: 2008-07-15
- Inventor: Eng Hooi Yap , Cheng Siew Tay , Pek Chew Tan
- Applicant: Eng Hooi Yap , Cheng Siew Tay , Pek Chew Tan
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
An apparatus and system, as well as fabrication methods therefor, may include a substrate coupled to a first material and a second material. The first and second materials may comprise adjacent metals, and may have different coefficients of thermal expansion sufficient to reduce the amount of substrate warp that can occur due to heating and cooling.
Public/Granted literature
- US20040256720A1 Thermal interface apparatus, systems, and methods Public/Granted day:2004-12-23
Information query
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