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1.发明授权Printed circuit boards having pads for solder balls and methods for the implementation thereof 有权具有用于焊球的焊盘的印刷电路板及其实施方法公开(公告)号：US08533657B2
公开(公告)日：2013-09-10
申请号：US13195638
申请日：2011-08-01
Applicant: Cheng Siew Tay , Wendy Chet Ming Ngoh , Choi Keng Chan
Inventor： Cheng Siew Tay , Wendy Chet Ming Ngoh , Choi Keng Chan
IPC: G06F17/50
CPC classification number: H05K1/111 , H05K2201/09227 , H05K2201/09281 , H05K2201/09481 , H05K2201/10734 , Y02P70/611 , Y10T29/49144 , Y10T29/5313
Abstract: A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after that solder-ball is soldered to that pad. For a pad of that group having a microvia located therein, a center of that microvia is located farther than a center of that pad from its crack initiation point. For a pad of that group having a trace merging along a portion of its perimeter, that portion does not include a vicinity of that crack initiation point.
Abstract translation: 印刷电路板包括适合于焊接到装置的相应组焊球的一组焊盘。 该组的每个焊盘在其焊接球被焊接到该焊盘之后预期在焊球上的裂纹开始的位置处具有在其周边上的裂纹起始点。 对于具有位于其中的微孔的该组的垫，该微孔的中心位于比该垫的中心从其裂纹起始点更远的位置。 对于具有沿着其周边的一部分的轨迹合并的该组的焊盘，该部分不包括该裂纹起始点的附近。
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公开(公告)号：US07789285B2
公开(公告)日：2010-09-07
申请号：US11975227
申请日：2007-10-17
Applicant: Cheng Siew Tay , Pek Chew Tan , Swee Kian Cheng , Eng Hooi Yap
Inventor： Cheng Siew Tay , Pek Chew Tan , Swee Kian Cheng , Eng Hooi Yap
CPC classification number: B23K1/0016 , B23K2101/42 , H01L21/4853 , H01L21/486 , H05K3/3484 , H05K2201/0266 , H05K2201/035 , H05K2201/09472 , H05K2201/09509 , H05K2203/043 , H05K2203/1476
Abstract: In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the second size is greater than the first size.
Abstract translation: 在一个实施例中，提供了一种方法。 该方法包括用形成第一尺寸的焊球的焊膏填充在焊盘中形成的微孔; 以及用包括第二尺寸的焊球的焊膏涂覆所述接合焊盘，其中所述第二尺寸大于所述第一尺寸。
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公开(公告)号：US07242084B2
公开(公告)日：2007-07-10
申请号：US11139223
申请日：2005-05-27
Applicant: Chee Wai Wong , Cheng Siew Tay
Inventor： Chee Wai Wong , Cheng Siew Tay
IPC: H01L23/48
CPC classification number: H01L23/49811 , H01L23/49816 , H01L2224/16225 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/15312 , H05K3/303 , H05K3/3421 , H05K3/3447 , H05K2201/09472 , H05K2201/09509 , H05K2201/10303 , H05K2201/10318 , H05K2201/10598 , H05K2201/10659 , H05K2201/10734 , Y02P70/613
Abstract: Apparatuses and associated methods to improve integrated circuit packaging are generally described. More specifically, apparatuses and associated methods to improve solder joint reliability are described. In this regard, according to one example embodiment, one or more strengthening pin(s) are coupled to the periphery of a package substrate, the strengthening pin(s) capable of coupling to a circuit board.
Abstract translation: 通常描述用于改进集成电路封装的装置和相关方法。 更具体地，描述了提高焊点可靠性的装置和相关方法。 在这方面，根据一个示例实施例，一个或多个加强销耦合到封装基板的周边，加强销能够耦合到电路板。
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4.发明申请公开(公告)号：US20110310547A1
公开(公告)日：2011-12-22
申请号：US13195638
申请日：2011-08-01
Applicant: Cheng Siew TAY , Wendy Chet Ming NGOH , Choi Keng CHAN
Inventor： Cheng Siew TAY , Wendy Chet Ming NGOH , Choi Keng CHAN
CPC classification number: H05K1/111 , H05K2201/09227 , H05K2201/09281 , H05K2201/09481 , H05K2201/10734 , Y02P70/611 , Y10T29/49144 , Y10T29/5313
Abstract: A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after that solder-ball is soldered to that pad. For a pad of that group having a microvia located therein, a center of that microvia is located farther than a center of that pad from its crack initiation point. For a pad of that group having a trace merging along a portion of its perimeter, that portion does not include a vicinity of that crack initiation point.
Abstract translation: 印刷电路板包括适合于焊接到装置的相应组焊球的一组焊盘。 该组的每个焊盘在其焊接球被焊接到该焊盘之后预期在焊球上的裂纹开始的位置处具有在其周边上的裂纹起始点。 对于具有位于其中的微孔的该组的垫，该微孔的中心位于比该垫的中心从其裂纹起始点更远的位置。 对于具有沿着其周边的一部分的轨迹合并的该组的焊盘，该部分不包括该裂纹起始点的附近。
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公开(公告)号：US07642660B2
公开(公告)日：2010-01-05
申请号：US11616164
申请日：2006-12-26
Applicant: Cheng Siew Tay , Swee Kian Cheng , Eng Huat Goh
Inventor： Cheng Siew Tay , Swee Kian Cheng , Eng Huat Goh
IPC: H01L21/00
CPC classification number: H01L23/49816 , H01L23/49838 , H01L2924/0002 , H05K3/3452 , H05K2201/09418 , H05K2201/0989 , H05K2201/099 , H05K2201/10734 , H01L2924/00
Abstract: A method and apparatus is provided that pertains to resisting crack initiation and propagation in electrical interconnections between components and substrates in ball grid array microelectronic packages. A hybrid of dielectric defined and non-dielectric defined electrical interconnects reduces the potential for electrical interconnection failure without having to control the dielectric defined interconnect ratio of substrates. In addition selective orientation of the dielectric defined edge portion of the electrical interconnect away from the point where cracks initiate resists crack propagation and component failure.
Abstract translation: 提供了一种方法和装置，其涉及抵抗在球栅阵列微电子封装中的部件和基板之间的电互连中的裂纹起始和传播。 电介质限定和非介质限定的电互连的混合物减少了电互连故障的可能性，而不必控制介质限定的衬底互连比。 此外，电互连的电介质限定边缘部分远离开始点的选择性取向抵抗裂纹扩展和部件故障。
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Patent Agency Ranking
公开(公告)号：US07331503B2
公开(公告)日：2008-02-19
申请号：US10976980
申请日：2004-10-29
Applicant: Cheng Siew Tay , Pek Chew Tan , Swee Kian Cheng , Eng Hooi Yap
Inventor： Cheng Siew Tay , Pek Chew Tan , Swee Kian Cheng , Eng Hooi Yap
IPC: B23K31/02
CPC classification number: B23K1/0016 , B23K2101/42 , H01L21/4853 , H01L21/486 , H05K3/3484 , H05K2201/0266 , H05K2201/035 , H05K2201/09472 , H05K2201/09509 , H05K2203/043 , H05K2203/1476
Abstract: In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the second size is greater than the first size.
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7.发明授权Printed circuit boards having pads for solder balls and methods for the implementation thereof 有权具有用于焊球的焊盘的印刷电路板及其实施方法公开(公告)号：US07326859B2
公开(公告)日：2008-02-05
申请号：US10735638
申请日：2003-12-16
Applicant: Cheng Siew Tay , Wendy Chet Ming Ngoh , Choi Keng Chan
Inventor： Cheng Siew Tay , Wendy Chet Ming Ngoh , Choi Keng Chan
IPC: H05K1/16
CPC classification number: H05K1/111 , H05K2201/09227 , H05K2201/09281 , H05K2201/09481 , H05K2201/10734 , Y02P70/611 , Y10T29/49144 , Y10T29/5313
Abstract: A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after that solder-ball is soldered to that pad. For a pad of that group having a microvia located therein, a center of that microvia is located farther than a center of that pad from its crack initiation point. For a pad of that group having a trace merging along a portion of its perimeter, that portion does not include a vicinity of that crack initiation point.
Abstract translation: 印刷电路板包括适合于焊接到装置的相应组焊球的一组焊盘。 该组的每个焊盘在其焊接球被焊接到该焊盘之后预期在焊球上的裂纹开始的位置处具有在其周边上的裂纹起始点。 对于具有位于其中的微孔的该组的垫，该微孔的中心位于比该垫的中心从其裂纹起始点更远的位置。 对于具有沿着其周边的一部分的轨迹合并的该组的焊盘，该部分不包括该裂纹起始点的附近。
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公开(公告)号：US07400040B2
公开(公告)日：2008-07-15
申请号：US10458603
申请日：2003-06-10
Applicant: Eng Hooi Yap , Cheng Siew Tay , Pek Chew Tan
Inventor： Eng Hooi Yap , Cheng Siew Tay , Pek Chew Tan
CPC classification number: H05K1/0271 , H01L23/3735 , H01L2924/0002 , H05K3/4602 , H05K3/4641 , H05K2201/068 , H01L2924/00
Abstract: An apparatus and system, as well as fabrication methods therefor, may include a substrate coupled to a first material and a second material. The first and second materials may comprise adjacent metals, and may have different coefficients of thermal expansion sufficient to reduce the amount of substrate warp that can occur due to heating and cooling.
Abstract translation: 装置和系统及其制造方法可以包括耦合到第一材料和第二材料的衬底。 第一和第二材料可以包括相邻的金属，并且可以具有足够的不同的热膨胀系数，以减少由于加热和冷却而可能发生的基底翘曲的量。
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9.发明授权Printed circuit boards having pads for solder balls and methods for the implementation thereof 有权具有用于焊球的焊盘的印刷电路板及其实施方法公开(公告)号：US08079011B2
公开(公告)日：2011-12-13
申请号：US12000366
申请日：2007-12-12
Applicant: Cheng Siew Tay , Wendy Chet Ming Ngoh , Choi Keng Chan
Inventor： Cheng Siew Tay , Wendy Chet Ming Ngoh , Choi Keng Chan
CPC classification number: H05K1/111 , H05K2201/09227 , H05K2201/09281 , H05K2201/09481 , H05K2201/10734 , Y02P70/611 , Y10T29/49144 , Y10T29/5313
Abstract: A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after that solder-ball is soldered to that pad. For a pad of that group having a microvia located therein, a center of that microvia is located farther than a center of that pad from its crack initiation point. For a pad of that group having a trace merging along a portion of its perimeter, that portion does not include a vicinity of that crack initiation point.
Abstract translation: 印刷电路板包括适合于焊接到装置的相应组焊球的一组焊盘。 该组的每个焊盘在其焊接球被焊接到该焊盘之后预期在焊球上的裂纹开始的位置处具有在其周边上的裂纹起始点。 对于具有位于其中的微孔的该组的垫，该微孔的中心位于比该垫的中心从其裂纹起始点更远的位置。 对于具有沿着其周边的一部分的轨迹合并的该组的焊盘，该部分不包括该裂纹起始点的附近。
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公开(公告)号：US07173342B2
公开(公告)日：2007-02-06
申请号：US10322308
申请日：2002-12-17
Applicant: Cheng Siew Tay , Swee Kian Cheng , Eng Huat Goh
Inventor： Cheng Siew Tay , Swee Kian Cheng , Eng Huat Goh
IPC: H01L23/485
CPC classification number: H01L23/49816 , H01L23/49838 , H01L2924/0002 , H05K3/3452 , H05K2201/09418 , H05K2201/0989 , H05K2201/099 , H05K2201/10734 , H01L2924/00
Abstract: A method and apparatus is provided that pertains to resisting crack initiation and propagation in electrical interconnections between components and substrates in ball grid array microelectronic packages. A hybrid of dielectric defined and non-dielectric defined electrical interconnects reduces the potential for electrical interconnection failure without having to control the dielectric defined interconnect ratio of substrates. In addition selective orientation of the dielectric defined edge portion of the electrical interconnect away from the point where cracks initiate resists crack propagation and component failure.
Abstract translation: 提供了一种方法和装置，其涉及抵抗在球栅阵列微电子封装中的部件和基板之间的电互连中的裂纹起始和传播。 电介质限定和非介质限定的电互连的混合物减少了电互连故障的可能性，而不必控制介质限定的衬底互连比。 此外，电互连的电介质限定边缘部分远离开始点的选择性取向抵抗裂纹扩展和部件故障。
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