发明授权
- 专利标题： Composite wiring structure having a wiring block and an insulating layer with electrical connections to probes
- 专利标题（中）： 复合布线结构具有布线块和与探针电连接的绝缘层
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申请号： US11692035申请日： 2007-03-27
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公开(公告)号： US07400157B2公开(公告)日： 2008-07-15
- 发明人: Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
- 申请人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
- 申请人地址： US CA Livermore
- 专利权人： FormFactor, Inc.
- 当前专利权人： FormFactor, Inc.
- 当前专利权人地址： US CA Livermore
- 代理商 N. Kenneth Burraston
- 主分类号： G01R31/02
- IPC分类号： G01R31/02 ; G06F17/50 ; H01L29/10 ; H05K3/36
摘要：
A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
公开/授权文献
- US20070247176A1 Method of Manufacturing a Probe Card 公开/授权日：2007-10-25
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