Invention Grant
- Patent Title: Silver electroplating solution
- Patent Title (中): 银电镀液
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Application No.: US10512632Application Date: 2003-10-30
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Publication No.: US07402232B2Publication Date: 2008-07-22
- Inventor: Yoko Ogihara , Shinichi Wakabayashi , Masao Nakazawa
- Applicant: Yoko Ogihara , Shinichi Wakabayashi , Masao Nakazawa
- Applicant Address: JP Nagano
- Assignee: Shinko Electric Industries, Co., Ltd.
- Current Assignee: Shinko Electric Industries, Co., Ltd.
- Current Assignee Address: JP Nagano
- Agency: Chadbourne & Parke LLP
- Agent Walter G. Hanchuk
- Priority: JP2002-345783 20021128
- International Application: PCT/JP03/13955 WO 20031030
- International Announcement: WO2004/048646 WO 20040610
- Main IPC: C25D3/46
- IPC: C25D3/46 ; B22F7/00

Abstract:
A silver electroplating solution containing a cyanide as a silver source, said silver electroplating solution characterized by containing at least one type of compound of As, Tl, Se, and Te as a brightener and a brightness adjuster having a benzothiazole skeleton or benzoxazole skeleton. This plating solution utilizes the high speed property of gloss agents to the maximum, does not have an effect on the current density, gives stable non- or semi-gloss plating appearance, and facilitates control.
Public/Granted literature
- US20060060474A1 electrolytic silver plating solution Public/Granted day:2006-03-23
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