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公开(公告)号：US20060283713A1
公开(公告)日：2006-12-21
申请号：US11419904
申请日：2006-05-23
Applicant: Yoko Ogihara , Takeshi Takano , Kazuo Nakabayashi
Inventor： Yoko Ogihara , Takeshi Takano , Kazuo Nakabayashi
IPC: C25D5/02
CPC classification number: C25D5/022 , C25D17/02 , H01L2924/0002 , H01L2924/00
Abstract: A selective plating apparatus for applying selective electrolytic plating to a metal member includes: a mask member having a recess portion so that a space is formed to which predetermined parts of a surface of the metal member are exposed when the mask member is attached to the metal member, and having at least one supply opening for supplying electrolytic plating solution into the space and a discharge opening for discharging the electrolytic plating solution from the space both formed in a bottom portion of the recess portion; and at least one injection nozzle which injects the electrolytic plating solution in an oblique direction with respect to the predetermined parts of the surface of the metal member, and is arranged in vicinity of the supply opening.
Abstract translation: 一种用于向金属构件施加选择性电镀的选择性电镀装置包括：掩模构件，具有凹部，使得当掩模构件附接到金属时，形成金属构件的表面的预定部分露出的空间 并且具有至少一个用于向该空间供应电解电镀液的供给开口和用于从形成在凹部的底部的空间排出电解镀液的排出口; 以及至少一个注射喷嘴，其相对于金属构件的表面的预定部分沿倾斜方向注入电解镀液，并且布置在供应开口附近。
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公开(公告)号：US20060275953A1
公开(公告)日：2006-12-07
申请号：US11421602
申请日：2006-06-01
Applicant: Yoko Ogihara
Inventor： Yoko Ogihara
IPC: H01L21/00
CPC classification number: C25D5/34 , C25D5/18 , H01L23/49582 , H01L2924/0002 , H01L2924/00
Abstract: Upon applying a copper strike plating to a surface of a substrate made of a copper alloy that was subjected to a heat treatment after a degreasing process and an electrolytic activating process are applied to the surface, a pulse current by which a current appears like a series of pulses only on a polarity side onto which a copper metal is deposited on the surface of the substrate is applied to the substrate in the copper strike plating such that a crystal plane showing a maximum value of an X-ray diffraction intensity of a copper strike plating layer formed on the surface of the substrate corresponds to a (111) plane as a crystal plane showing a maximum value of an X-ray diffraction intensity of the copper layer into which metal crystals made of copper are most densely filled.
Abstract translation: 当在表面上施加了铜触击电镀到在脱脂处理和电解激活处理之后进行热处理的由铜合金制成的基板的表面上时，电流看起来像串联的脉冲电流 仅在基板表面上沉积有铜金属的极性侧的脉冲施加到铜冲击电镀中的基板，使得显示铜触击的X射线衍射强度的最大值的晶面 形成在基板表面上的镀层对应于作为晶面的（111）面，其表示由铜制成的金属晶体最密集填充的铜层的X射线衍射强度的最大值。
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公开(公告)号：US07402232B2
公开(公告)日：2008-07-22
申请号：US10512632
申请日：2003-10-30
Applicant: Yoko Ogihara , Shinichi Wakabayashi , Masao Nakazawa
Inventor： Yoko Ogihara , Shinichi Wakabayashi , Masao Nakazawa
CPC classification number: C25D3/46
Abstract: A silver electroplating solution containing a cyanide as a silver source, said silver electroplating solution characterized by containing at least one type of compound of As, Tl, Se, and Te as a brightener and a brightness adjuster having a benzothiazole skeleton or benzoxazole skeleton. This plating solution utilizes the high speed property of gloss agents to the maximum, does not have an effect on the current density, gives stable non- or semi-gloss plating appearance, and facilitates control.
Abstract translation: 含有氰化物作为银源的银电镀溶液，所述银电镀溶液的特征在于含有至少一种As，Tl，Se和Te化合物作为增白剂和具有苯并噻唑骨架或苯并恶唑骨架的亮度调节剂。 该镀液最大限度地利用光泽剂的高速特性，不会对电流密度产生影响，提供稳定的非光泽或半光泽的电镀外观，便于控制。
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公开(公告)号：US20060060474A1
公开(公告)日：2006-03-23
申请号：US10512632
申请日：2003-10-30
Applicant: Yoko Ogihara , Shinichi Wakabayashi , Masao Nakazawa
Inventor： Yoko Ogihara , Shinichi Wakabayashi , Masao Nakazawa
CPC classification number: C25D3/46
Abstract: A silver electroplating solution containing a cyanide as a silver source, said silver electroplating solution characterized by containing at least one type of compound of As, Tl, Se, and Te as a brightener and a brightness adjuster having a benzothiazole skeleton or benzoxazole skeleton. This plating solution utilizes the high speed property of gloss agents to the maximum, does not have an effect on the current density, gives stable non- or semi-gloss plating appearance, and facilitates control.
Abstract translation: 含有氰化物作为银源的银电镀溶液，所述银电镀溶液的特征在于含有至少一种As，Tl，Se和Te化合物作为增白剂和具有苯并噻唑骨架或苯并恶唑骨架的亮度调节剂。 该镀液最大限度地利用光泽剂的高速特性，不会对电流密度产生影响，提供稳定的非光泽或半光泽的电镀外观，便于控制。
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Patent Agency Ranking
公开(公告)号：US07713398B2
公开(公告)日：2010-05-11
申请号：US11419904
申请日：2006-05-23
Applicant: Yoko Ogihara , Takeshi Takano , Kazuo Nakabayashi
Inventor： Yoko Ogihara , Takeshi Takano , Kazuo Nakabayashi
IPC: C25D5/08
CPC classification number: C25D5/022 , C25D17/02 , H01L2924/0002 , H01L2924/00
Abstract: A selective plating apparatus for applying selective electrolytic plating to a metal member includes: a mask member having a recess portion so that a space is formed to which predetermined parts of a surface of the metal member are exposed when the mask member is attached to the metal member, and having at least one supply opening for supplying electrolytic plating solution into the space and a discharge opening for discharging the electrolytic plating solution from the space both formed in a bottom portion of the recess portion; and at least one injection nozzle which injects the electrolytic plating solution in an oblique direction with respect to the predetermined parts of the surface of the metal member, and is arranged in vicinity of the supply opening.
Abstract translation: 一种用于向金属构件施加选择性电镀的选择性电镀装置包括：掩模构件，具有凹部，使得当掩模构件附接到金属时，形成金属构件的表面的预定部分露出的空间 并且具有至少一个用于向该空间供应电解电镀液的供给开口和用于从形成在凹部的底部的空间排出电解镀液的排出口; 以及至少一个注射喷嘴，其相对于金属构件的表面的预定部分沿倾斜方向注入电解镀液，并且布置在供应开口附近。
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公开(公告)号：US20060027462A1
公开(公告)日：2006-02-09
申请号：US11197263
申请日：2005-08-05
Applicant: Yoko Ogihara , Masao Nakazawa
Inventor： Yoko Ogihara , Masao Nakazawa
IPC: C25D3/40
Abstract: A copper strike plating bath comprising a copper cyanide compound and one or more of salts of inorganic acids and salts of organic acids. The copper cyanide compound is preferably sodium copper cyanide, potassium copper cyanide or a mixture thereof.
Abstract translation: 包含氰化铜化合物和一种或多种无机酸盐和有机酸盐的铜触镀浴。 氰化铜化合物优选为氰化铜钠，氰化钾铜或其混合物。
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公开(公告)号：US20050139488A1
公开(公告)日：2005-06-30
申请号：US10972138
申请日：2004-10-22
Applicant: Yoko Ogihara , Masao Nakazawa
Inventor： Yoko Ogihara , Masao Nakazawa
IPC: C25F5/00 , C25D3/46 , H01L23/495 , H01L23/50
CPC classification number: C25F5/00 , H01L23/49582 , H01L24/45 , H01L2224/45144 , H01L2224/48639 , H01L2224/85439 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01028 , H01L2224/48 , H01L2924/00
Abstract: The present invention provides an electrolytic stripping method comprising electrolytically stripping: a copper plating film exposed from a silver plating film that partially covers a copper plating film formed on the entire surface of a member; and leaking silver formed on an exposed portion of the copper plating film and having a smaller thickness than the silver plating film, using the copper plating film as an anode, wherein the electrolytic stripping is carried out using a cyan compound-free electrolytic copper-stripping liquid, and the electrolytic stripping liquid comprises a compound capable of forming, with silver, a complex ion that is more easily dissociated than a complex ion of silver and cyan; and wherein silver and copper are deposited on a cathode which is used as a counter electrode to the anode and which is made of a metal that is chemically stable against the electrolytic stripping liquid.
Abstract translation: 本发明提供了一种电解剥离方法，包括电解剥离：从镀银膜暴露的铜电镀膜，其部分地覆盖形成在构件的整个表面上的镀铜膜; 以及使用铜镀膜作为阳极，形成在镀铜膜的暴露部分上并且具有比银镀膜更薄的厚度的银，其中电解剥离是使用无氰化合物的电解铜剥离 液体，并且电解剥离液体包含能够与银形成比银和青色的复合离子更容易解离的复合离子的化合物; 并且其中银和铜沉积在阴极上，该阴极用作与阳极相对的电极，并且由对电解汽提液体具有化学稳定性的金属制成。
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公开(公告)号：US20050126926A1
公开(公告)日：2005-06-16
申请号：US10971898
申请日：2004-10-22
Applicant: Yoko Ogihara , Masao Nakazawa
Inventor： Yoko Ogihara , Masao Nakazawa
CPC classification number: C25F5/00 , H01L2924/0002 , H01L2924/00
Abstract: The present invention provides an electrolytic copper-stripping liquid free from a cyan compound, which comprises a copper compound or an aromatic nitro compound as a copper-oxidizing agent, and which has a pH of from 9 to 12. Also disclosed is an electrolytic stripping method using the electrolytic stripping liquid.
Abstract translation: 本发明提供一种不含青色化合物的电解铜剥离液，其包含铜化合物或芳族硝基化合物作为铜氧化剂，并且其pH为9至12.还公开了电解汽提 方法使用电解汽提液。
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公开(公告)号：US5211830A
公开(公告)日：1993-05-18
申请号：US676847
申请日：1991-03-28
Applicant: Katsuhiko Tomita , Masami Nakane , Yoko Ogihara
Inventor： Katsuhiko Tomita , Masami Nakane , Yoko Ogihara
IPC: G01N27/28 , G01N27/333
CPC classification number: G01N27/3335
Abstract: A sheet-type, highly polymerized composite electrode used for measuring ionic concentration includes a thin film ion-selective responsive membrane formed on an upper surface of an insulating support layer by sequentially dripping an ion-selective responsive membrane paste containing solvent onto the support layer. The ion-selective responsive paste has a polymerization degree sufficient to provide an enduring ion-responsive membrane without any reinforcing structure.
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