Invention Grant
- Patent Title: Method and apparatus for measuring thickness of thin article
- Patent Title (中): 用于测量薄制品厚度的方法和装置
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Application No.: US11283294Application Date: 2005-11-18
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Publication No.: US07403288B2Publication Date: 2008-07-22
- Inventor: Jhy-Chain Lin
- Applicant: Jhy-Chain Lin
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Priority: TW93139379A 20041217
- Main IPC: G01B11/02
- IPC: G01B11/02 ; G01B9/02

Abstract:
An apparatus (100) for measuring a thickness of a thin article according to an embodiment of the present apparatus is provided. The apparatus includes an optical fiber interferometer (101), a signal processor module (102) and a measuring module (103). The optical fiber interferometer is configured for obtaining an optical distance difference. This optical distance difference is a result of the thickness of the thin article between a first optical path in which the thin article is measured and a second optical path. The signal processor module is configured for converting an optical distance difference into a phase difference and processing the optical distance difference to obtain a linear signal. That linear signal is convertible into a thickness value of the thin article.
Public/Granted literature
- US20060132797A1 Method and apparatus for measuring thickness of thin article Public/Granted day:2006-06-22
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