发明授权
- 专利标题: Substrate processing method
- 专利标题(中): 基板加工方法
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申请号: US10874245申请日: 2004-06-24
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公开(公告)号: US07407821B2公开(公告)日: 2008-08-05
- 发明人: Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Akira Fukunaga
- 申请人: Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Akira Fukunaga
- 申请人地址: JP Tokyo
- 专利权人: Ebara Corporation
- 当前专利权人: Ebara Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP2003-185061 20030627
- 主分类号: H01L21/66
- IPC分类号: H01L21/66
摘要:
There is provided a substrate processing method and apparatus which can measure and monitor thickness and/or properties of a film formed on a substrate as needed, and quickly correct a deviation in process conditions, and which can therefore stably provide a product of constant quality. A substrate processing method for processing a substrate having a metal and an insulating material exposed on its surface in such a manner that a film thickness of the metal, with an exposed surface of the metal as a reference plane, is selectively or preferentially changed, including measuring a change in the film thickness and/or a film property of the metal during and/or immediately after processing, and monitoring processing and adjusting processing conditions based on results of this measurement.
公开/授权文献
- US20050009213A1 Substrate processing method and apparatus 公开/授权日:2005-01-13