发明授权
- 专利标题： Method for processing a substrate
- 专利标题（中）： 处理基板的方法
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申请号： US10814768申请日： 2004-03-31
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公开(公告)号： US07419702B2公开(公告)日： 2008-09-02
- 发明人: Kazuhito Nakamura , Cory Wajda , Enrico Mosca , Yumiko Kawano , Gert Leusink , Fenton R. McFeely , Sandra G. Malhotra
- 申请人： Kazuhito Nakamura , Cory Wajda , Enrico Mosca , Yumiko Kawano , Gert Leusink , Fenton R. McFeely , Sandra G. Malhotra
- 申请人地址： JP Tokyo US NY Armonk
- 专利权人： Tokyo Electron Limited,International Business Machines Corp.
- 当前专利权人： Tokyo Electron Limited,International Business Machines Corp.
- 当前专利权人地址： JP Tokyo US NY Armonk
- 代理机构： Wood, Herron & Evans, LLP
- 主分类号： C23C16/00
- IPC分类号： C23C16/00 ; B05D3/04
摘要：
A method for processing a substrate on a ceramic substrate heater in a process chamber. The method includes forming a protective coating on the ceramic substrate heater in the process chamber and processing a substrate on the coated substrate heater. The processing can include providing a substrate to be processed on the coated ceramic substrate heater, performing a process on the substrate by exposing the substrate to a process gas, and removing the processed substrate from the process chamber.
公开/授权文献
- US20050221002A1 Method for processing a substrate 公开/授权日：2005-10-06