发明授权
- 专利标题： Electronic component and semiconductor wafer, and method for producing the same
- 专利标题（中）： 电子元件和半导体晶片及其制造方法
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申请号： US10789033申请日： 2004-02-27
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公开(公告)号： US07420262B2公开(公告)日： 2008-09-02
- 发明人: Michael Bauer , Peter Strobel , Gerald Ofner , Edward Fürgut , Simon Jerebic , Thomas Bemmerl , Markus Fink , Hermann Vilsmeier
- 申请人： Michael Bauer , Peter Strobel , Gerald Ofner , Edward Fürgut , Simon Jerebic , Thomas Bemmerl , Markus Fink , Hermann Vilsmeier
- 申请人地址： DE Munich
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Munich
- 代理机构： Dicke, Billig, Czaja PLLC
- 优先权： DE10308855 20030227
- 主分类号： H01L21/66
- IPC分类号： H01L21/66
摘要：
The invention relates to an electronic component and a semiconductor wafer, and a method for producing them. The semiconductor wafer has strip-type separating regions. The separating regions are provided with through contacts in the direction of the rear side of the semiconductor wafer. The semiconductor chip separated from such a semiconductor wafer constitutes an electronic component with external contacts in the form of edge contacts. Such an electronic component of semiconductor chip size can be used in diverse ways.