Invention Grant
- Patent Title: Wafer-level packaging of optoelectronic devices
- Patent Title (中): 晶圆级封装的光电器件
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Application No.: US11071550Application Date: 2005-03-02
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Publication No.: US07422929B2Publication Date: 2008-09-09
- Inventor: Kendra J. Gallup , Frank S. Geefay , Ronald Shane Fazzio , Martha Johnson , Carrie Ann Guthrie , Tanya Jegeris Snyder , Richard C. Ruby
- Applicant: Kendra J. Gallup , Frank S. Geefay , Ronald Shane Fazzio , Martha Johnson , Carrie Ann Guthrie , Tanya Jegeris Snyder , Richard C. Ruby
- Applicant Address: SG Singapore
- Assignee: Avago Technologies Fiber IP Pte Ltd
- Current Assignee: Avago Technologies Fiber IP Pte Ltd
- Current Assignee Address: SG Singapore
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
In an embodiment, the invention provides a method for forming a wafer-level package. A bonding pad is formed on a first wafer. After forming the bonding pad, an optoelectronic device is located on the first wafer. A gasket is formed on a second wafer. After a gasket is formed on a second wafer, the second wafer is attached to the first wafer with a bond between the gasket and the bonding pad.
Public/Granted literature
- US20050142692A1 Wafer-level packaging of optoelectronic devices Public/Granted day:2005-06-30
Information query
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