Invention Grant
- Patent Title: Apparatus, unit and method for testing image sensor packages
- Patent Title (中): 用于测试图像传感器封装的装置,单元和方法
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Application No.: US11457771Application Date: 2006-07-14
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Publication No.: US07427768B2Publication Date: 2008-09-23
- Inventor: Young-Seok Kim , Hwan-Chul Lee , Jae-Cheol Ju
- Applicant: Young-Seok Kim , Hwan-Chul Lee , Jae-Cheol Ju
- Applicant Address: KR Anyang-si
- Assignee: Optopac Co., Ltd.
- Current Assignee: Optopac Co., Ltd.
- Current Assignee Address: KR Anyang-si
- Agency: Marger Johnson & McCollom PC
- Priority: KR10-2005-0121803 20051212; KR10-2005-0121805 20051212
- Main IPC: G01N21/86
- IPC: G01N21/86 ; G01N21/88 ; G01V8/00 ; G01R31/02 ; G01R31/26 ; G01R31/28

Abstract:
The present invention relates to an apparatus, unit and method for testing image sensor packages, which can automatically test whether the image sensor packages are defective before they are assembled into camera modules. An apparatus for testing image sensor packages according to the present invention comprises a seating unit on which image sensor packages are seated for tests; a testing section having a lens and a light source above the image sensor packages to perform an open and short test and an image test for the image sensor packages; and a controlling and processing unit having a tester module for performing the open and short test and the image test for the image sensor packages. A method for testing image sensor packages according to the present invention comprises the steps of connecting the image sensor packages to a tester module for performing tests for checking whether the image sensor packages are defective; and carrying out an open and short test and an image test for the image sensor packages while irradiating light on the image sensor packages through a lens or blocking the light.
Public/Granted literature
- US20070131881A1 APPARATUS, UNIT AND METHOD FOR TESTING IMAGE SENSOR PACKAGES Public/Granted day:2007-06-14
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