Invention Grant
- Patent Title: Electrostatic chuck for wafer metrology and inspection equipment
- Patent Title (中): 用于晶圆计量和检测设备的静电卡盘
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Application No.: US10449539Application Date: 2003-05-29
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Publication No.: US07430104B2Publication Date: 2008-09-30
- Inventor: Alon Litman , Igor Krivts
- Applicant: Alon Litman , Igor Krivts
- Applicant Address: US CA Santa Clara
- Assignee: Appiled Materials, Inc.
- Current Assignee: Appiled Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agent Tarek N. Fahmi
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H05F3/00
Abstract:
An electrostatic chuck is configured for electrostatically securing a wafer while limiting charge on the wafer and physical contact between the electrostatic chuck and the wafer. The electrostatic chuck has a pair of electrodes and at least one support pin electrically isolated from the electrodes. The top portion of the support pin protrudes above the top surface of the electrodes. The support pin can be such that the top portion of the support pin is adjustable with respect to the top surfaces of the electrodes.
Public/Granted literature
- US20040179323A1 Electrostatic chuck for wafer metrology and inspection equipment Public/Granted day:2004-09-16
Information query
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