Abstract:
An electrostatic chuck is configured for electrostatically securing a wafer while limiting charge on the wafer and physical contact between the electrostatic chuck and the wafer. The electrostatic chuck has a pair of electrodes and at least one support pin electrically isolated from the electrodes. The top portion of the support pin protrudes above the top surface of the electrodes. The support pin can be such that the top portion of the support pin is adjustable with respect to the top surfaces of the electrodes.
Abstract:
Wafer supporting apparatus, including an electrostatic chuck for supporting the wafer. The apparatus further includes an electrostatic shield which is positioned in proximity to the chuck and the wafer, and a voltage source which is coupled to apply an electric field between the chuck and the wafer. The voltage source applies one or more potentials to the electrostatic shield so as to prevent penetration of particles to the wafer.
Abstract:
A method and system are presented for directing a charged particle beam towards and away from a sample. The system comprises a lens arrangement having an electrode formed with a beam opening for a charged particle beam passage therethrough; and a magnetic deflector. The magnetic deflector has a magnetic circuit formed by a core part for carrying excitation coils and a polepieces part. The polepieces of the magnetic deflector are in electrical communication with the electrode of the lens arrangement and are electrically insulated from the other part of the magnetic circuit.
Abstract:
A process chamber for processing or inspecting a substrate such as a semiconductor wafer and the like includes a internal chamber employing dynamic seals at the interface of relatively moving elements. In one embodiment, the internal chamber has a first element, such as a lid or cover, and a second element, such as the body of the chamber. The first element and the second element meet at the interface. The internal chamber may further include a substrate support, mounted inside the internal chamber, supporting a substrate. A first movement system may produce at least one type of relative movement between the first element and the second element. A second movement system may produce second relative movement between the second element and the substrate support. The resulting structure allows movement of the chamber, while maintaining pressure inside the chamber.
Abstract:
A substrate inspection system includes two or more inspection modules supported on a plate. A chamber is supported beneath the plate by a translation system, which is configured to provide horizontal displacement of the chamber under the plate to permit loading and unloading of a substrate to/from the chamber. Thus, when the chamber is in a loading/unloading position it is at least partially uncovered from the plate. The translation system may be further configured to provide vertical displacement of the chamber with respect to the plate so as to position an upper surface of a wall of the chamber in close proximity to a lower surface of the plate when the chamber is in an inspection position. In such a position, the upper surface of the wall of the chamber and the lower surface of the plate may be separated by an air gap.
Abstract:
Wafer supporting apparatus, including an electrostatic chuck for supporting the wafer. The apparatus further includes an electrostatic shield which is positioned in proximity to the chuck and the wafer, and a voltage source which is coupled to apply an electric field between the chuck and the wafer. The voltage source applies one or more potentials to the electrostatic shield so as to prevent penetration of particles to the wafer.
Abstract:
A substrate inspection system includes two or more inspection modules supported on a plate. A chamber is supported beneath the plate by a translation system, which is configured to provide horizontal displacement of the chamber under the plate to permit loading and unloading of a substrate to/from the chamber. Thus, when the chamber is in a loading/unloading position it is at least partially uncovered from the plate. The translation system may be further configured to provide vertical displacement of the chamber with respect to the plate so as to position an upper surface of a wall of the chamber in close proximity to a lower surface of the plate when the chamber is in an inspection position. In such a position, the upper surface of the wall of the chamber and the lower surface of the plate may be separated by an air gap.
Abstract:
A method and system are presented for directing a charged particle beam towards and away from a sample. The system comprises a lens arrangement having an electrode formed with a beam opening for a charged particle beam passage therethrough; and a magnetic deflector. The magnetic deflector has a magnetic circuit formed by a core part for carrying excitation coils and a polepieces part. The polepieces of the magnetic deflector are in electrical communication with the electrode of the lens arrangement and are electrically insulated from the other part of the magnetic circuit.
Abstract:
A deflection system is presented for use in a lens arrangement of a charged particle beam column for inspecting a sample. The system comprises a magnetic deflector operable to create a magnetic field, and a pole piece assembly at least partly accommodated within the magnetic field. The pole piece assembly has a portion made of a soft magnetic material and is formed with an opening for a charged particle beam propagation therethrough. The deflection system allows for conducting the magnetic field created by the magnetic deflector through the pole piece assembly towards the opening in the pole piece assembly. This enables to increase the magnetic field value in the vicinity of the sample at the optical axis of the lens arrangement at a given electric current through the excitation coils of the magnetic deflector, without a need to increase a working distance.