发明授权
- 专利标题： Ceramic package, assembled substrate, and manufacturing method therefor
- 专利标题（中）： 陶瓷封装，组装衬底及其制造方法
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申请号： US11198135申请日： 2005-08-08
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公开(公告)号： US07432590B2公开(公告)日： 2008-10-07
- 发明人: Natsuyo Nagano , Takashi Ogura , Masanori Hongo , Masami Fukuyama
- 申请人： Natsuyo Nagano , Takashi Ogura , Masanori Hongo , Masami Fukuyama
- 申请人地址： JP Osaka
- 专利权人： Sanyo Electric Co., Ltd
- 当前专利权人： Sanyo Electric Co., Ltd
- 当前专利权人地址： JP Osaka
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP.
- 优先权： JP2004-234590 20040811
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L23/48
摘要：
In a ceramic package including one or more ceramic layers and being capable of having an electronic component and a lid fixed to a surface thereof, a surface of a ceramic layer having a sealing electrode for joining the lid through a sealing member and a pad to be connected to input and output electrodes and/or a ground electrode of the electronic component is divided into an inner portion having the pad and an outer portion having the sealing electrode with a stepped side wall as a border for preventing the sealing member from flowing, and one of the inner portion and the outer portion projects relative to the other.