发明授权
- 专利标题： Semiconductor encapsulating epoxy resin composition and semiconductor device
- 专利标题（中）： 半导体封装环氧树脂组合物和半导体器件
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申请号： US11138378申请日： 2005-05-27
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公开(公告)号： US07432603B2公开(公告)日： 2008-10-07
- 发明人: Eiichi Asano , Toshio Shiobara
- 申请人： Eiichi Asano , Toshio Shiobara
- 申请人地址： JP Tokyo
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： JP2004-160551 20040531
- 主分类号： H01L23/29
- IPC分类号： H01L23/29 ; C08L63/00 ; B32B27/04 ; B32B27/20 ; B32B27/38 ; H01L21/56
摘要：
In an epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic compound, and (D) an inorganic filler, the inorganic compound (C) is an oxide of metal elements at least one of which is a metal element of Group II in the Periodic Table having a second ionization potential of up to 20 eV, typically Zn2SiO4, ZnCrO4, ZnFeO4 or ZnMoO4. When used for semiconductor encapsulation, the epoxy resin composition is highly reliable and cures into a product which is effective for minimizing electrical failure such as defective insulation due to a copper migration phenomenon.
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