公开(公告)号：US07432603B2

公开(公告)日：2008-10-07

申请号：US11138378

申请日：2005-05-27

Applicant: Eiichi Asano ,  Toshio Shiobara

Inventor： Eiichi Asano ,  Toshio Shiobara

IPC: H01L23/29 ,  C08L63/00 ,  B32B27/04 ,  B32B27/20 ,  B32B27/38 ,  H01L21/56

CPC classification number: C08G59/08 ,  C08G59/621 ,  C08G59/688 ,  Y10T428/31511 ,  Y10T428/31522 ,  Y10T428/31529

Abstract: In an epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic compound, and (D) an inorganic filler, the inorganic compound (C) is an oxide of metal elements at least one of which is a metal element of Group II in the Periodic Table having a second ionization potential of up to 20 eV, typically Zn2SiO4, ZnCrO4, ZnFeO4 or ZnMoO4. When used for semiconductor encapsulation, the epoxy resin composition is highly reliable and cures into a product which is effective for minimizing electrical failure such as defective insulation due to a copper migration phenomenon.

Abstract translation: 在包含（A）环氧树脂，（B）固化剂，（C）无机化合物和（D）无机填料）的环氧树脂组合物中，无机化合物（C）是至少一种金属元素的氧化物 其中元素周期表中的II族金属元素具有高达20eV的第二电离电位，通常为Zn 2 SiO 4，ZnCrO 4， / SO 2，ZnFeO 4或ZnMoO 4。 当用于半导体封装时，环氧树脂组合物是高度可靠的并且固化成对于最小化电气故障有效的产品，例如由于铜迁移现象导致的不良绝缘。

公开(公告)号：US20070207322A1

公开(公告)日：2007-09-06

申请号：US11711661

申请日：2007-02-28

Applicant: Yasuo Kimura ,  Eiichi Asano

Inventor： Yasuo Kimura ,  Eiichi Asano

IPC: B32B27/38 ,  H01L21/56 ,  C08L63/00 ,  B32B27/18

CPC classification number: H01L23/293 ,  C08G59/38 ,  C08G59/621 ,  C08G59/688 ,  H01L21/565 ,  H01L2924/0002 ,  Y10T428/31511 ,  H01L2924/00

Abstract: An epoxy resin composition comprising (A) a mixture of a naphthalene type epoxy resin and an anthracene type epoxy resin, (B) a curing agent in the form of a naphthalene type phenolic resin, and (C) an inorganic filler is best suited for semiconductor encapsulation.

Abstract translation: 一种环氧树脂组合物，其包含（A）萘型环氧树脂和蒽型环氧树脂的混合物，（B）萘型酚醛树脂形式的固化剂和（C）无机填料最适合于 半导体封装。

公开(公告)号：US06297306B1

公开(公告)日：2001-10-02

申请号：US09310924

申请日：1999-05-13

Applicant: Shoichi Osada ,  Takayuki Aoki ,  Toshio Shiobara ,  Kazutoshi Tomiyoshi ,  Eiichi Asano

Inventor： Shoichi Osada ,  Takayuki Aoki ,  Toshio Shiobara ,  Kazutoshi Tomiyoshi ,  Eiichi Asano

IPC: C08K310

CPC classification number: C08K3/22 ,  C08K3/2279 ,  C08K2003/2227 ,  C08L63/00

Abstract: An epoxy resin composition comprising (A) a biphenyl skeleton epoxy resin, (B) a biphenyl skeleton phenolic resin as a curing agent, (C) molybdenum compound, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.

Abstract translation: 一种环氧树脂组合物，其包含（A）联苯骨架环氧树脂，（B）作为固化剂的联苯骨架酚醛树脂，（C）钼化合物和（D）无机填料适合于半导体封装，因为它是有效模塑的 并固化成具有改善的回流裂纹性，耐湿性和阻燃性的部分。 它不会对人体健康或环境构成危害。

公开(公告)号：US06291556B1

公开(公告)日：2001-09-18

申请号：US09534386

申请日：2000-03-24

Applicant: Shoichi Osada ,  Eiichi Asano ,  Shigeki Ino ,  Takayuki Aoki ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

Inventor： Shoichi Osada ,  Eiichi Asano ,  Shigeki Ino ,  Takayuki Aoki ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

IPC: C08K6300

CPC classification number: H01L23/293 ,  C08K3/2279 ,  C08K9/08 ,  C08K2003/026 ,  C08K2201/019 ,  C08L63/00 ,  H01L2924/0002 ,  C08L2666/22 ,  C08L61/04 ,  H01L2924/00

Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a microencapsulated flame retardant comprising a red phosphorus-base core coated with a thermoplastic resin and/or thermosetting resin, (D) a molybdenum compound, and (E) an inorganic filler. The composition and its cured product have moisture-proof reliability and high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.

Abstract translation: 提供半导体封装环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）包含涂覆有热塑性树脂和/或热固性树脂的红磷基芯的微胶囊阻燃剂， （D）钼化合物和（E）无机填料。 即使没有卤化环氧树脂和氧化锑，该组合物及其固化产品具有防湿可靠性和高阻燃性。

公开(公告)号：US08048969B2

公开(公告)日：2011-11-01

申请号：US11408955

申请日：2006-04-24

Applicant: Shoichi Osada ,  Yasuo Kimura ,  Eiichi Asano ,  Toshio Shiobara

Inventor： Shoichi Osada ,  Yasuo Kimura ,  Eiichi Asano ,  Toshio Shiobara

IPC: C08F283/00 ,  B32B27/38 ,  C08G59/50

CPC classification number: C08G59/245 ,  C08G59/3218 ,  C08L63/00 ,  Y10T428/31511 ,  C08L2666/16 ,  C08L2666/22

Abstract: An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a curing agent in the form of a naphthalene type phenolic resin, (C) an inorganic filler, and (D) a phosphazene compound is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.

Abstract translation: 一种环氧树脂组合物，其包含（A）萘型环氧树脂，其中35-85重量份的1,1-双（2-缩水甘油氧基-1-萘基）烷烃和1-35重量份的1,1-双 （2,7-二缩水甘油氧基-1-萘基）烷烃包括每100重量份树脂，（B）萘型酚醛树脂形式的固化剂，（C）无机填料，（D） 磷氮烯化合物最适合于半导体封装，因为它具有良好的流动性，低的线膨胀系数，高的Tg，最小的吸湿性和无铅焊接时的抗裂纹性。

公开(公告)号：US20060241250A1

公开(公告)日：2006-10-26

申请号：US11408955

申请日：2006-04-24

Applicant: Shoichi Osada ,  Yasuo Kimura ,  Eiichi Asano ,  Toshio Shiobara

Inventor： Shoichi Osada ,  Yasuo Kimura ,  Eiichi Asano ,  Toshio Shiobara

IPC: C08L63/00

CPC classification number: C08G59/245 ,  C08G59/3218 ,  C08L63/00 ,  Y10T428/31511 ,  C08L2666/16 ,  C08L2666/22

Abstract: An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a curing agent in the form of a naphthalene type phenolic resin, (C) an inorganic filler, and (D) a phosphazene compound is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.

Abstract translation: 一种环氧树脂组合物，其包含（A）萘型环氧树脂，其中35-85重量份的1,1-双（2-缩水甘油氧基-1-萘基）烷烃和1-35重量份的1,1-双 （2,7-二缩水甘油氧基-1-萘基）烷烃包括每100重量份树脂，（B）萘型酚醛树脂形式的固化剂，（C）无机填料，（D） 磷氮烯化合物最适合于半导体封装，因为它具有良好的流动性，低的线膨胀系数，高的Tg，最小的吸湿性和无铅焊接时的抗裂纹性。

公开(公告)号：US20060241215A1

公开(公告)日：2006-10-26

申请号：US11409099

申请日：2006-04-24

Applicant: Shoichi Osada ,  Yasuo Kimura ,  Eiichi Asano ,  Toshio Shiobara

Inventor： Shoichi Osada ,  Yasuo Kimura ,  Eiichi Asano ,  Toshio Shiobara

IPC: C08L63/00

CPC classification number: C08G59/245 ,  C08G59/621 ,  C08K3/22 ,  C08K3/26 ,  H01L23/293 ,  H01L23/295 ,  H01L2924/0002 ,  C08L63/00 ,  H01L2924/00

Abstract: An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a curing agent in the form of a naphthalene type phenolic resin, (C) an inorganic filler, and (D) a rare earth oxide or hydrotalcite compound is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.

Abstract translation: 环氧树脂组合物，其包含（A）萘型环氧树脂，其中35-85重量份的1,1-双（2-缩水甘油氧基-1-萘基）烷烃和1-35重量份的1,1-双 （2,7-二缩水甘油氧基-1-萘基）烷烃包括每100重量份的树脂，（B）萘型酚醛树脂形式的固化剂，（C）无机填料，（D） 稀土氧化物或水滑石化合物最适合于半导体封装，因为它具有良好的流动性，低的线膨胀系数，高的Tg，最小的吸湿性和无铅焊接时的抗裂性。

公开(公告)号：US20060216519A1

公开(公告)日：2006-09-28

申请号：US11386667

申请日：2006-03-23

Applicant: Yasuo Kimura ,  Eiichi Asano ,  Toshio Shiobara ,  Takayuki Aoki

Inventor： Yasuo Kimura ,  Eiichi Asano ,  Toshio Shiobara ,  Takayuki Aoki

IPC: B32B27/38 ,  H01L21/56 ,  C08L63/00 ,  C08G59/00

CPC classification number: H01L23/293 ,  C08G59/245 ,  C08G59/3218 ,  C08G59/621 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/31511 ,  C08L2666/16 ,  H01L2924/00

Abstract: An epoxy resin composition comprising (A) at least one epoxy resin comprising (a) a naphthalene ring-containing epoxy resin having at least one substituted or unsubstituted naphthalene ring in a molecule and having an epoxy equivalent of 175 to 210, (B) a phenolic resin having at least one substituted or unsubstituted naphthalene ring in a molecule, and (C) an inorganic filler, the substituted or unsubstituted naphthalene ring of the epoxy resin (a) being contained in an amount of 45 to 60% by weight in the total amount of the epoxy resin (A) is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.

Abstract translation: 一种环氧树脂组合物，其包含（A）至少一种环氧树脂，其包含（a）在分子中具有至少一个取代或未取代的萘环并且具有175至210的环氧当量的含萘环的环氧树脂，（B） 在分子中具有至少一个取代或未取代的萘环的酚醛树脂和（C）无机填料，所述环氧树脂（a）中的取代或未取代的萘环的含量为45〜60重量％ 环氧树脂（A）的总量最适合于半导体封装，因为它具有良好的流动性，低的线性膨胀系数，高的Tg，最小的吸湿性和无铅焊接时的抗裂纹性。

公开(公告)号：US06630745B1

公开(公告)日：2003-10-07

申请号：US09558384

申请日：2000-04-26

Applicant: Shoichi Osada ,  Eiichi Asano ,  Shigeki Ino ,  Takayuki Aoki ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

Inventor： Shoichi Osada ,  Eiichi Asano ,  Shigeki Ino ,  Takayuki Aoki ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

IPC: H01L2329

CPC classification number: H01L23/293 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/12528 ,  Y10T428/31511 ,  C08L83/00 ,  H01L2924/00

Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.

Abstract translation: 提供半导体封装环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）钼化合物，（Di）有机聚硅氧烷，（D-ii）有机聚硅氧烷固化产物或（ D-iii）通过环氧树脂或含烯基的环氧树脂与有机氢聚硅氧烷反应得到的嵌段共聚物和（E）无机填料。 尽管没有卤化环氧树脂和氧化锑，该组合物具有改进的成型性和耐焊料裂纹性，同时显示出高阻燃性。

公开(公告)号：US06627328B2

公开(公告)日：2003-09-30

申请号：US09950737

申请日：2001-09-13

Applicant: Tatsuya Kanamaru ,  Tsuyoshi Honda ,  Eiichi Asano ,  Toshio Shiobara

Inventor： Tatsuya Kanamaru ,  Tsuyoshi Honda ,  Eiichi Asano ,  Toshio Shiobara

IPC: H01L2912

CPC classification number: C08L63/00 ,  Y10T428/12528 ,  Y10T428/31511

Abstract: An epoxy resin composition comprising (A) an epoxy resin, (B) a curing accelerator, and (C) an inorganic filler is light transmissive when it satisfies formulae (1) and (2): [{2(nA2+nC2)−(nA+nC)2}/2]½

Abstract translation: 包含（A）环氧树脂，（B）固化促进剂和（C）无机填料的环氧树脂组合物当满足式（1）和（2）时是透光的：其中nA是在T1° 固化的未填充组合物的c为n C为无机填料的T1℃的折射率，fA为固化的未填充组合物的折射率的温度系数，f C为折射率的温度系数 无机填料。 固化的组合物在宽温度范围内具有改善的耐热性，耐湿性和低应力以及高透明度。 该组合物适用于光学半导体器件的密封。