发明授权
- 专利标题： Pattern inspection method and apparatus using electron beam
- 专利标题（中）： 使用电子束的图案检查方法和装置
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申请号： US11176344申请日： 2005-07-08
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公开(公告)号： US07439504B2公开(公告)日： 2008-10-21
- 发明人: Takashi Hiroi , Asahiro Kuni , Masahiro Watanabe , Chie Shishido , Hiroyuki Shinada , Yasuhiro Gunji , Atsuko Takafuji
- 申请人： Takashi Hiroi , Asahiro Kuni , Masahiro Watanabe , Chie Shishido , Hiroyuki Shinada , Yasuhiro Gunji , Atsuko Takafuji
- 申请人地址： JP Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JP2000-226181 20000721
- 主分类号： G01N23/00
- IPC分类号： G01N23/00 ; G21K7/00
摘要：
A pattern inspection method and apparatus in which a charged particle beam is irradiated onto a surface of a specimen on which a pattern is formed, plural sensors simultaneously detect secondary particles emanated from the surface of the specimen by the irradiation, signals outputted from each sensor of the plural sensors which simultaneously detect the secondary particles are added, an image of the surface of the specimen on which the pattern is obtained from the added signals, and the image is processed to detect a defect of the pattern.