发明授权
US07442879B2 Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate
有权
具有焊料涂覆的微粒糊料连接的电路化衬底，多层衬底组件，利用其的电气组件和信息处理系统以及制造所述衬底的方法
- 专利标题： Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate
- 专利标题（中）： 具有焊料涂覆的微粒糊料连接的电路化衬底，多层衬底组件，利用其的电气组件和信息处理系统以及制造所述衬底的方法
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申请号： US11244180申请日： 2005-10-06
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公开(公告)号： US07442879B2公开(公告)日： 2008-10-28
- 发明人: Rabindra N. Das , John M. Lauffer , Roy H. Magnuson , Voya R. Markovich
- 申请人： Rabindra N. Das , John M. Lauffer , Roy H. Magnuson , Voya R. Markovich
- 申请人地址： US NY Endicott
- 专利权人： Endicott Interconect Technologies, Inc.
- 当前专利权人： Endicott Interconect Technologies, Inc.
- 当前专利权人地址： US NY Endicott
- 代理机构： Hinman, Howard & Kattell
- 代理商 Mark Levy; Lawrence R. Fraley
- 主分类号： H01R12/04
- IPC分类号： H01R12/04 ; H05K1/11
摘要：
A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a binder component and at least one metallic component including microparticles. In another embodiment, the paste includes the binder and a plurality of nano-wires. Selected ones of the microparticles or nano-wires include a layer of solder thereon. A method of making such a substrate is also provided, as are an electrical assembly and information handling system adapter for having such a substrate as part thereof.