Invention Grant
US07442983B2 Method for making a semiconductor device having a high-k gate dielectric
有权
制造具有高k栅极电介质的半导体器件的方法
- Patent Title: Method for making a semiconductor device having a high-k gate dielectric
- Patent Title (中): 制造具有高k栅极电介质的半导体器件的方法
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Application No.: US11390892Application Date: 2006-03-27
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Publication No.: US07442983B2Publication Date: 2008-10-28
- Inventor: Mark L. Doczy , Gilbert Dewey , Suman Datta , Sangwoo Pae , Justin K. Brask , Jack Kavalieros , Matthew V. Metz , Adrian B. Sherrill , Markus Kuhn , Robert S. Chau
- Applicant: Mark L. Doczy , Gilbert Dewey , Suman Datta , Sangwoo Pae , Justin K. Brask , Jack Kavalieros , Matthew V. Metz , Adrian B. Sherrill , Markus Kuhn , Robert S. Chau
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L27/108
- IPC: H01L27/108

Abstract:
A method for making a semiconductor device is described. That method comprises forming an oxide layer on a substrate, and forming a high-k dielectric layer on the oxide layer. The oxide layer and the high-k dielectric layer are then annealed at a sufficient temperature for a sufficient time to generate a gate dielectric with a graded dielectric constant.
Public/Granted literature
- US20060166447A1 Method for making a semiconductor device having a high-k gate dielectric Public/Granted day:2006-07-27
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