Invention Grant
- Patent Title: Substrate with slot
- Patent Title (中): 基板与插槽
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Application No.: US11341877Application Date: 2006-01-27
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Publication No.: US07449770B2Publication Date: 2008-11-11
- Inventor: Chiu-Shun Lin , Po-Chiang Tseng , Chen-Li Wang , Chia-Ying Lee
- Applicant: Chiu-Shun Lin , Po-Chiang Tseng , Chen-Li Wang , Chia-Ying Lee
- Applicant Address: TW
- Assignee: Himax Technologies, Inc.
- Current Assignee: Himax Technologies, Inc.
- Current Assignee Address: TW
- Agency: Ladas & Parry LLP
- Priority: TW94104035A 20050205
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/52 ; H01L23/48 ; H01L23/40
Abstract:
The invention relates to a substrate with slot. The substrate of the invention comprises an active surface and a plurality of metal plates. The metal plates are formed on the active surface. Each metal plate has a first surface and a second surface. The first surface is connected to the active surface. At least one metal plate has at least one slot formed on the second surface. Therefore, according to the substrate with slot of the invention, a resin for connecting a chip and the metal plates can entirely seal sides and corners of the chip so as to prevent water or dust from entering the chip and protect the chip.
Public/Granted literature
- US20060175088A1 Substrate with slot Public/Granted day:2006-08-10
Information query
IPC分类:
