发明授权
US07452568B2 Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation
有权
离心方法，用于提供具有电路形成的粉末材料的高纵横比盲孔
- 专利标题： Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation
- 专利标题（中）： 离心方法，用于提供具有电路形成的粉末材料的高纵横比盲孔
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申请号： US11049846申请日： 2005-02-04
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公开(公告)号： US07452568B2公开(公告)日： 2008-11-18
- 发明人: Gareth Hougham , Leena Paivikki Buchwalter , Stephen L. Buchwalter , Jon Casey , Claudius Feger , Matteo Flotta , Jeffrey D. Gelorme , Kathleen C. Hinge , Anurag Jain , Sung K. Kang , John U. Knickerbocker
- 申请人： Gareth Hougham , Leena Paivikki Buchwalter , Stephen L. Buchwalter , Jon Casey , Claudius Feger , Matteo Flotta , Jeffrey D. Gelorme , Kathleen C. Hinge , Anurag Jain , Sung K. Kang , John U. Knickerbocker
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Connolly Bove Lodge & Hutz LLP
- 代理商 Daniel P. Morris, Esq.
- 主分类号： B05D3/12
- IPC分类号： B05D3/12 ; B05D1/42
摘要：
The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.
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