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US07462571B2 Film formation method and apparatus for semiconductor process for forming a silicon nitride film 有权
用于形成氮化硅膜的半导体工艺的成膜方法和装置

Film formation method and apparatus for semiconductor process for forming a silicon nitride film
Abstract:
An impurity-doped silicon nitride or oxynitride film is formed on a target substrate by CVD, in a process field to be selectively supplied with a first process gas containing a silane family gas, a second process gas containing a nitriding or oxynitriding gas, and a third process gas containing a doping gas. This method alternately includes first to fourth steps. The first step performs supply of the first and third process gases to the field. The second step stops supply of the first to third process gases to the field. The third step performs supply of the second process gas to the field while stopping supply of the first and third process gases to the field, and includes an excitation period of exciting the second process gas by an exciting mechanism. The fourth step stops supply of the first to third process gases to the field.
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