Invention Grant
- Patent Title: Film formation method and apparatus for semiconductor process for forming a silicon nitride film
- Patent Title (中): 用于形成氮化硅膜的半导体工艺的成膜方法和装置
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Application No.: US11188736Application Date: 2005-07-26
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Publication No.: US07462571B2Publication Date: 2008-12-09
- Inventor: Kazuhide Hasebe , Mitsuhiro Okada , Pao-Hwa Chou , Chaeho Kim , Jun Ogawa
- Applicant: Kazuhide Hasebe , Mitsuhiro Okada , Pao-Hwa Chou , Chaeho Kim , Jun Ogawa
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- Priority: JP2004-220555 20040728; JP2005-048060 20050223; JP2005-177344 20050617
- Main IPC: H01L21/31
- IPC: H01L21/31

Abstract:
An impurity-doped silicon nitride or oxynitride film is formed on a target substrate by CVD, in a process field to be selectively supplied with a first process gas containing a silane family gas, a second process gas containing a nitriding or oxynitriding gas, and a third process gas containing a doping gas. This method alternately includes first to fourth steps. The first step performs supply of the first and third process gases to the field. The second step stops supply of the first to third process gases to the field. The third step performs supply of the second process gas to the field while stopping supply of the first and third process gases to the field, and includes an excitation period of exciting the second process gas by an exciting mechanism. The fourth step stops supply of the first to third process gases to the field.
Public/Granted literature
- US20060032443A1 Film formation method and apparatus for semiconductor process Public/Granted day:2006-02-16
Information query
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