发明授权
- 专利标题： Methods of fabricating a micromechanical structure
- 专利标题（中）： 制造微机械结构的方法
-
申请号： US11451424申请日： 2006-06-13
-
公开(公告)号： US07468327B2公开(公告)日： 2008-12-23
- 发明人: Chia-Hua Chang , Hua-Shu Wu , Tsung-Mu Lai
- 申请人： Chia-Hua Chang , Hua-Shu Wu , Tsung-Mu Lai
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 主分类号： H01L21/31
- IPC分类号： H01L21/31
摘要：
Methods of fabricating a microelectromechanical structure are provided. An exemplary embodiment of a method of fabricating a microelectromechanical structure comprises providing a substrate. A first patterned sacrificial layer is formed on portions of the substrate, the first patterned sacrificial layer comprises a bulk portion and a protrusion portion. A second patterned sacrificial layer is formed over the first sacrificial layer, covering the protrusion portion and portions of the bulk portion of the first patterned sacrificial layer, wherein the second patterned sacrificial layer does not cover sidewalls of the first patterned sacrificial layer. An element layer is formed over the substrate, covering portions of the substrate, the first patterned sacrificial layer and second patterned sacrificial layer. The first and second patterned sacrificial layers are removed, leaving a microstructure on the substrate.
公开/授权文献
- US20070287213A1 Methods of fabricating a micromechanical structure 公开/授权日：2007-12-13
信息查询
IPC分类:
