A substrate structure having a solder mask and a process for making the same, including (a) providing a substrate having a top surface, the top surface having a die pad and a plurality of solder pads; (b) forming a first solder mask on the top surface, the first solder mask having a plurality of openings, each opening corresponding to each solder pad so as to expose at least part of the solder pad; and (c) forming a second solder mask on the first solder mask. The substrate structure can be used for packaging a thicker die so as to prevent the die crack and the overflow of molding compound will be avoided.