发明授权
- 专利标题： Solder ball loading method and solder ball loading unit background of the invention
- 专利标题（中）： 焊球加载方法和焊球加载单元
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申请号： US11371083申请日： 2006-03-09
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公开(公告)号： US07475803B2公开(公告)日： 2009-01-13
- 发明人: Atsunori Sumita , Yoichiro Kawamura , Shigeki Sawa , Katsuhiko Tanno , Isao Tsuchiya , Yoshiyuki Mabuchi , Osamu Kimura
- 申请人： Atsunori Sumita , Yoichiro Kawamura , Shigeki Sawa , Katsuhiko Tanno , Isao Tsuchiya , Yoshiyuki Mabuchi , Osamu Kimura
- 申请人地址： JP Ogaki-shi
- 专利权人： Ibiden Co., Ltd.
- 当前专利权人： Ibiden Co., Ltd.
- 当前专利权人地址： JP Ogaki-shi
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权： JP2004-227875 20040804; JP2005-190496 20050629; JP2005-190497 20050629; JP2005-190498 20050629; JP2005-190499 20050629
- 主分类号： B23K31/02
- IPC分类号： B23K31/02 ; H01L21/44
摘要：
Provides a solder ball loading unit capable of loading fine solder balls on electrodes. Solder balls 78s are gathered by sucking air from a loading cylinder 24 located above a ball arranging mask 16. The gathered solder balls 78s are rolled on the ball arranging mask 16 by moving the loading cylinder 24 in a horizontal direction and the solder balls 78s are dropped onto the electrodes 75 on a multilayer printed wiring board 10 through an openings 16a in the ball arranging mask 16.
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