发明授权
US07476981B2 Electronic module with layer of adhesive and process for producing it
有权
具有粘合剂层的电子模块及其生产工艺
- 专利标题： Electronic module with layer of adhesive and process for producing it
- 专利标题（中）： 具有粘合剂层的电子模块及其生产工艺
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申请号： US10505066申请日： 2003-02-14
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公开(公告)号： US07476981B2公开(公告)日： 2009-01-13
- 发明人: Robert Bergmann , Joachim Mahler
- 申请人： Robert Bergmann , Joachim Mahler
- 申请人地址： DE Munich
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Munich
- 代理机构： Dicke, Billig, Czaja, PLLC
- 优先权： DE10206818 20020218
- 国际申请： PCT/DE03/00458 WO 20030214
- 国际公布： WO03/071596 WO 20030828
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52
摘要：
The present invention relates to an electronic module having a layer of adhesive between metallic surfaces of components of the module. The metallic surfaces are arranged facing one another. The adhesive of the layer of adhesive includes agglomerates of nanoparticles, which form paths, surrounded by an adhesive base composition, in the adhesive base composition. Furthermore, the invention relates to a process for producing the module.
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