Invention Grant
- Patent Title: Lamination of dry film to micro-fluid ejection head substrates
- Patent Title (中): 将干膜层压到微流体喷射头基板上
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Application No.: US11208815Application Date: 2005-08-22
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Publication No.: US07479203B2Publication Date: 2009-01-20
- Inventor: David L. Bernard , Christopher A. Craft , Gary R. Williams
- Applicant: David L. Bernard , Christopher A. Craft , Gary R. Williams
- Applicant Address: US KY Lexington
- Assignee: Lexmark International, Inc.
- Current Assignee: Lexmark International, Inc.
- Current Assignee Address: US KY Lexington
- Agency: Luedeka, Neely & Graham, PC
- Main IPC: B31B1/60
- IPC: B31B1/60 ; B32B37/00 ; G03C5/00

Abstract:
A method of making a micro-fluid ejection head structure and structures made by the method. The method includes planarizing a heated substrate component of a micro-fluid ejection head structure by applying a clamping voltage to an electrostatic chuck sufficient to hold the substrate component in a planarized orientation. A polymeric nozzle layer is laminated to the heated substrate component in a manner sufficient to provide a planarized nozzle layer on the substrate component.
Public/Granted literature
- US20070039676A1 Lamination of dry film to micro-fluid ejection head substrates Public/Granted day:2007-02-22
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