Invention Grant
US07479203B2 Lamination of dry film to micro-fluid ejection head substrates 有权
将干膜层压到微流体喷射头基板上

Lamination of dry film to micro-fluid ejection head substrates
Abstract:
A method of making a micro-fluid ejection head structure and structures made by the method. The method includes planarizing a heated substrate component of a micro-fluid ejection head structure by applying a clamping voltage to an electrostatic chuck sufficient to hold the substrate component in a planarized orientation. A polymeric nozzle layer is laminated to the heated substrate component in a manner sufficient to provide a planarized nozzle layer on the substrate component.
Public/Granted literature
Information query
Patent Agency Ranking
0/0