Lamination of dry film to micro-fluid ejection head substrates
    1.
    发明授权
    Lamination of dry film to micro-fluid ejection head substrates 有权
    将干膜层压到微流体喷射头基板上

    公开(公告)号:US07479203B2

    公开(公告)日:2009-01-20

    申请号:US11208815

    申请日:2005-08-22

    IPC分类号: B31B1/60 B32B37/00 G03C5/00

    摘要: A method of making a micro-fluid ejection head structure and structures made by the method. The method includes planarizing a heated substrate component of a micro-fluid ejection head structure by applying a clamping voltage to an electrostatic chuck sufficient to hold the substrate component in a planarized orientation. A polymeric nozzle layer is laminated to the heated substrate component in a manner sufficient to provide a planarized nozzle layer on the substrate component.

    摘要翻译: 一种通过该方法制造微流体喷射头结构和结构的方法。 该方法包括通过向足以将基板部件保持平坦化取向的静电卡盘施加钳位电压来平坦化加热的微流体喷射头结构的衬底部件。 聚合物喷嘴层以足以在基底部件上提供平坦化喷嘴层的方式层压到加热的基底部件上。