发明授权
US07479449B2 Underfill and mold compounds including siloxane-based aromatic diamines
有权
底部填充剂和模塑化合物，包括硅氧烷基芳族二胺
- 专利标题： Underfill and mold compounds including siloxane-based aromatic diamines
- 专利标题（中）： 底部填充剂和模塑化合物，包括硅氧烷基芳族二胺
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申请号： US11856265申请日： 2007-09-17
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公开(公告)号： US07479449B2公开(公告)日： 2009-01-20
- 发明人: Saikumar Jayaraman
- 申请人： Saikumar Jayaraman
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： H01L21/4763
- IPC分类号： H01L21/4763
摘要：
A method including introducing a composition including a siloxane-based aromatic diamine in a flowable state between a first substrate including a first set of contact points and a second substrate including a second set of contact points coupled to the first substrate through interconnections between a portion of the first set of contact points a portion of the second set of contact points; and curing the composition.
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