发明授权
- 专利标题: Semiconductor element and method of manufacturing the same
- 专利标题(中): 半导体元件及其制造方法
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申请号: US11485284申请日: 2006-07-13
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公开(公告)号: US07479678B2公开(公告)日: 2009-01-20
- 发明人: Syotaro Ono , Wataru Saito , Yusuke Kawaguchi , Yoshihiro Yamaguchi
- 申请人: Syotaro Ono , Wataru Saito , Yusuke Kawaguchi , Yoshihiro Yamaguchi
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权: JP2005-204575 20050713
- 主分类号: H01L29/76
- IPC分类号: H01L29/76
摘要:
A semiconductor element is provided, comprising a first semiconductor layer of the first conduction type; and a pillar layer including first semiconductor pillars of the first conduction type and second semiconductor pillars of the second conduction type arranged periodically and alternately on the first semiconductor layer. A semiconductor base layer of the second conduction type is formed on the upper surface of the pillar layer, And a second semiconductor layer of the first conduction type is formed on the upper surface of the semiconductor base layer. A control electrode of the trench gate type is formed in a trench, which is formed in depth through the semiconductor base layer to the first semiconductor pillar. The control electrode is tapered such that the width thereof decreases with the distance from a second main electrode toward a first main electrode and the tip thereof locates almost at the center of the first semiconductor pillar.
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