发明授权
- 专利标题: Wire bonding apparatus and method for clamping a wire
- 专利标题(中): 导线接合装置和夹紧线的方法
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申请号: US10928402申请日: 2004-08-30
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公开(公告)号: US07481351B2公开(公告)日: 2009-01-27
- 发明人: Tae-Hyun Kim , Youn-Sung Ko , Young-Kyun Sun , Dae-Soo Kim , Kook-Jin Oh , Sang-Woo Lee , Dong-Bin Kim
- 申请人: Tae-Hyun Kim , Youn-Sung Ko , Young-Kyun Sun , Dae-Soo Kim , Kook-Jin Oh , Sang-Woo Lee , Dong-Bin Kim
- 申请人地址: KR Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-do
- 代理机构: Harness, Dickey & Pierce, P.L.C.
- 优先权: KR10-2003-0095437 20031223; KR10-2004-0020400 20040325
- 主分类号: B23K31/02
- IPC分类号: B23K31/02 ; B23K37/04
摘要:
A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically performed. A sensor may measure the length of the wire drawn through the capillary and the location of a ball that may be formed at a wire tail. An auxiliary clamp may be installed between the wire clamp and the capillary for drawing the wire using sensor information.
公开/授权文献
- US20050133563A1 Wire bonding apparatus and method for clamping a wire 公开/授权日:2005-06-23
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