发明授权
US07485536B2 Abrupt junction formation by atomic layer epitaxy of in situ delta doped dopant diffusion barriers
有权
通过原子层外延原位δ掺杂掺杂剂扩散阻挡层的突变结形成
- 专利标题: Abrupt junction formation by atomic layer epitaxy of in situ delta doped dopant diffusion barriers
- 专利标题(中): 通过原子层外延原位δ掺杂掺杂剂扩散阻挡层的突变结形成
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申请号: US11326178申请日: 2005-12-30
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公开(公告)号: US07485536B2公开(公告)日: 2009-02-03
- 发明人: Been-Yih Jin , Brian S. Doyle , Robert S. Chau , Jack T. Kavalieros
- 申请人: Been-Yih Jin , Brian S. Doyle , Robert S. Chau , Jack T. Kavalieros
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号: H01L21/335
- IPC分类号: H01L21/335
摘要:
A method including forming a channel region between source and drain regions in a substrate, the channel region including a first dopant profile; and forming a barrier layer between the channel region and a well of the substrate, the barrier layer including a second dopant profile different from the first dopant profile. An apparatus including a gate electrode on a substrate; source and drain regions formed in the substrate and separated by a channel region; and a barrier layer between a well of the substrate and the channel region, the barrier layer including a dopant profile different than a dopant profile of the channel region and different than a dopant profile of the well. A system including a computing device including a microprocessor, the microprocessor including a plurality of transistor devices formed in a substrate, each of the plurality of transistor devices including a gate electrode on the substrate; source and drain regions formed in the substrate and separated by a channel region; and a barrier layer between a well of the substrate and the channel region.
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