发明授权
- 专利标题： Interconnect structures with encasing cap and methods of making thereof
- 专利标题（中）： 具有封盖的互连结构及其制造方法
-
申请号： US11503259申请日： 2006-08-14
-
公开(公告)号： US07488677B2公开(公告)日： 2009-02-10
- 发明人: Kwong Hon Wong , Louis C. Hsu , Timothy J. Dalton , Carol Radens , Chih-Chao Yang , Lawrence A. Clevenger , Theodorus E. Standaert
- 申请人： Kwong Hon Wong , Louis C. Hsu , Timothy J. Dalton , Carol Radens , Chih-Chao Yang , Lawrence A. Clevenger , Theodorus E. Standaert
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Connolly Bove Lodge & Hutz LLP
- 代理商 Robert M. Trepp, Esq.
- 主分类号： H01L21/4763
- IPC分类号： H01L21/4763
摘要：
A method of making an interconnect that includes providing an interconnect structure in a dielectric material, recessing the dielectric material such that a portion of the interconnect structure extends above an upper surface of the dielectric; and depositing an encasing cap over the extended portion of the interconnect structure.
公开/授权文献
信息查询
IPC分类:
