Invention Grant
- Patent Title: Organic aluminum precursor and method of forming a metal wire using the same
- Patent Title (中): 有机铝前体和使用其形成金属丝的方法
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Application No.: US11523604Application Date: 2006-09-20
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Publication No.: US07488684B2Publication Date: 2009-02-10
- Inventor: Jung-Sik Choi , Jung-Ho Lee , Jun-Hyun Cho , Youn-Joung Cho , Tae-Sung Kim , Mi-Ae Kim , Kyoo-Chul Cho , Dong-Jun Lee
- Applicant: Jung-Sik Choi , Jung-Ho Lee , Jun-Hyun Cho , Youn-Joung Cho , Tae-Sung Kim , Mi-Ae Kim , Kyoo-Chul Cho , Dong-Jun Lee
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2005-0087508 20050921
- Main IPC: H01L21/285
- IPC: H01L21/285

Abstract:
An organic aluminum precursor includes aluminum as a central metal, and borohydride and trimethylamine as ligands. In a method of forming an aluminum layer or wire, the organic aluminum presursor is introduced onto a substrate, and then thermally decomposed. The aluminum decomposed from the organic aluminum precursor is deposited on the substrate.
Public/Granted literature
- US20070066061A1 Organic aluminum precursor and method of forming a metal wire using the same Public/Granted day:2007-03-22
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