Invention Grant
- Patent Title: Thin-film device
- Patent Title (中): 薄膜装置
-
Application No.: US11701458Application Date: 2007-02-02
-
Publication No.: US07489036B2Publication Date: 2009-02-10
- Inventor: Hajime Kuwajima , Masahiro Miyazaki , Akira Furuya , Masahiro Itoh
- Applicant: Hajime Kuwajima , Masahiro Miyazaki , Akira Furuya , Masahiro Itoh
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-041227 20060217
- Main IPC: H01L23/48
- IPC: H01L23/48

Abstract:
A thin-film device incorporates: a substrate; an insulating layer, a lower conductor layer, a dielectric film, an insulating layer, an upper conductor layer and a protection film that are stacked in this order on the substrate; and four terminal electrodes. The four terminal electrodes touch part of end faces of the upper conductor layer, and part of the top surface of the upper conductor layer contiguous to the end faces. The protection film has four concave portions, each of which has a shape that is recessed inward from the edge of the protection film except portions thereof corresponding to these concave portions. The four concave portions expose respective portions of the top surface of the upper conductor layer that touch the four terminal electrodes. The four concave portions accommodate respective portions of the four terminal electrodes.
Public/Granted literature
- US20070194404A1 Thin-film device Public/Granted day:2007-08-23
Information query
IPC分类: