发明授权
US07493822B2 Small gauge pressure sensor using wafer bonding and electrochemical etch stopping
有权
使用晶圆接合和电化学蚀刻停止的小型压力传感器
- 专利标题: Small gauge pressure sensor using wafer bonding and electrochemical etch stopping
- 专利标题(中): 使用晶圆接合和电化学蚀刻停止的小型压力传感器
-
申请号: US11825237申请日: 2007-07-05
-
公开(公告)号: US07493822B2公开(公告)日: 2009-02-24
- 发明人: Carl E. Stewart , Gilberto Morales , Richard A. Davis
- 申请人: Carl E. Stewart , Gilberto Morales , Richard A. Davis
- 申请人地址: US NJ Morristown
- 专利权人: Honeywell International Inc.
- 当前专利权人: Honeywell International Inc.
- 当前专利权人地址: US NJ Morristown
- 代理商 Kermit D. Lopez; Luis M. Ortiz
- 主分类号: G01L9/06
- IPC分类号: G01L9/06
摘要:
A gauge pressure sensor apparatus and a method of forming the same. A constraint wafer can be partially etched to set the diaphragm size, followed by bonding to a top wafer. The thickness of the top wafer is either the desired diaphragm thickness or is thinned to the desired thickness after bonding. The bonding of top wafer and constraint wafer enables electrochemical etch stopping. This allows the media conduit to be etched through the back of the constraint wafer and an electrical signal produced when the etching reaches the diaphragm. The process prevents the diaphragm from being over-etched. The invention allows the die size to be smaller than die where the diaphragm size is set by etching from the back side.