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公开(公告)号：US07798010B2
公开(公告)日：2010-09-21
申请号：US11973966
申请日：2007-10-11
IPC分类号： G01L1/00
CPC分类号： G01L19/146 , G01L19/04 , H01L2924/15151
摘要： The sensor geometry for improved package stress isolation is disclosed. A counterbore on the backing plate improves stress isolation properties of the sensor. The counterbore thins the wall of the backing plate maintaining the contact area with the package. The depth and diameter of the counterbore can be adjusted to find geometry for allowing the backing plate to absorb more package stresses. Thinning the wall of the backing plate make it less rigid and allows the backing plate to absorb more of the stresses produced at the interface with the package. The counterbore also keeps a large surface area at the bottom of the backing plate creating a strong bond with the package.
摘要翻译： 公开了用于改进封装应力隔离的传感器几何形状。 背板上的沉孔提高了传感器的应力隔离性能。 沉头孔沉浸在背板的壁上，保持与包装件的接触面积。 可以调节沉孔的深度和直径以找到允许背板吸收更多包装应力的几何形状。 使背板的壁变薄使其较不刚性，并且允许背板吸收在与封装的界面处产生的更多的应力。 沉孔还在背板的底部保持较大的表面积，从而与包装形成牢固的结合。
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公开(公告)号：US08082798B2
公开(公告)日：2011-12-27
申请号：US12857380
申请日：2010-08-16
IPC分类号： G01L1/00
CPC分类号： G01L19/146 , G01L19/04 , H01L2924/15151
摘要： The sensor geometry for improved package stress isolation is disclosed. A counterbore on the backing plate improves stress isolation properties of the sensor. The counterbore thins the wall of the backing plate maintaining the contact area with the package. The depth and diameter of the counterbore can be adjusted to find geometry for allowing the backing plate to absorb more package stresses. Thinning the wall of the backing plate make it less rigid and allows the backing plate to absorb more of the stresses produced at the interface with the package. The counterbore also keeps a large surface area at the bottom of the backing plate creating a strong bond with the package.
摘要翻译： 公开了用于改进封装应力隔离的传感器几何形状。 背板上的沉孔提高了传感器的应力隔离性能。 沉头孔沉浸在背板的壁上，保持与包装件的接触面积。 可以调节沉孔的深度和直径以找到允许背板吸收更多包装应力的几何形状。 使背板的壁变薄使其较不刚性，并且允许背板吸收在与封装的界面处产生的更多的应力。 沉孔还在背板的底部保持较大的表面积，从而与包装形成牢固的结合。
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公开(公告)号：US20100301435A1
公开(公告)日：2010-12-02
申请号：US12857380
申请日：2010-08-16
CPC分类号： G01L19/146 , G01L19/04 , H01L2924/15151
摘要： The sensor geometry for improved package stress isolation is disclosed. A counterbore on the backing plate improves stress isolation properties of the sensor. The counterbore thins the wall of the backing plate maintaining the contact area with the package. The depth and diameter of the counterbore can be adjusted to find geometry for allowing the backing plate to absorb more package stresses. Thinning the wall of the backing plate make it less rigid and allows the backing plate to absorb more of the stresses produced at the interface with the package. The counterbore also keeps a large surface area at the bottom of the backing plate creating a strong bond with the package.
摘要翻译： 公开了用于改进封装应力隔离的传感器几何形状。 背板上的沉孔提高了传感器的应力隔离性能。 沉头孔沉浸在背板的壁上，保持与包装件的接触面积。 可以调节沉孔的深度和直径以找到允许背板吸收更多包装应力的几何形状。 使背板的壁变薄使其较不刚性，并且允许背板吸收在与封装的界面处产生的更多的应力。 沉孔还在背板的底部保持较大的表面积，从而与包装形成牢固的结合。
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4.发明申请SMALL GAUGE PRESSURE SENSOR USING WAFER BONDING AND ELECTROCHEMICAL ETCH STOPPING 有权小型压力传感器采用波峰焊和电化学灭弧公开(公告)号：US20090007681A1
公开(公告)日：2009-01-08
申请号：US11825237
申请日：2007-07-05
CPC分类号： G01L9/0042 , G01L9/0054
摘要： A gauge pressure sensor apparatus and a method of forming the same. A constraint wafer can be partially etched to set the diaphragm size, followed by bonding to a top wafer. The thickness of the top wafer is either the desired diaphragm thickness or is thinned to the desired thickness after bonding. The bonding of top wafer and constraint wafer enables electrochemical etch stopping. This allows the media conduit to be etched through the back of the constraint wafer and an electrical signal produced when the etching reaches the diaphragm. The process prevents the diaphragm from being over-etched. The invention allows the die size to be smaller than die where the diaphragm size is set by etching from the back side.
摘要翻译： 表压传感器装置及其形成方法。 可以部分地蚀刻约束晶片以设置膜片尺寸，然后粘结到顶部晶片。 顶部晶片的厚度是所需的隔膜厚度，或者在粘结后被减薄到所需的厚度。 顶部晶片和约束晶片的结合使得电化学蚀刻停止。 这允许介质管道被蚀刻通过约束晶片的背面和当蚀刻到达隔膜时产生的电信号。 该过程防止隔膜过度蚀刻。 本发明允许模具尺寸小于通过从背面蚀刻设置膜片尺寸的模具。
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公开(公告)号：US20090096040A1
公开(公告)日：2009-04-16
申请号：US11973966
申请日：2007-10-11
CPC分类号： G01L19/146 , G01L19/04 , H01L2924/15151
摘要： The sensor geometry for improved package stress isolation is disclosed. A counterbore on the backing plate improves stress isolation properties of the sensor. The counterbore thins the wall of the backing plate maintaining the contact area with the package. The depth and diameter of the counterbore can be adjusted to find geometry for allowing the backing plate to absorb more package stresses. Thinning the wall of the backing plate make it less rigid and allows the backing plate to absorb more of the stresses produced at the interface with the package. The counterbore also keeps a large surface area at the bottom of the backing plate creating a strong bond with the package.
摘要翻译： 公开了用于改进封装应力隔离的传感器几何形状。 背板上的沉孔提高了传感器的应力隔离性能。 沉头孔沉浸在背板的壁上，保持与包装件的接触面积。 可以调节沉孔的深度和直径以找到允许背板吸收更多包装应力的几何形状。 使背板的壁变薄使其较不刚性，并且允许背板吸收在与封装的界面处产生的更多的应力。 沉孔还在背板的底部保持较大的表面积，从而与包装形成牢固的结合。
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6.发明授权Small gauge pressure sensor using wafer bonding and electrochemical etch stopping 有权使用晶圆接合和电化学蚀刻停止的小型压力传感器公开(公告)号：US07493822B2
公开(公告)日：2009-02-24
申请号：US11825237
申请日：2007-07-05
IPC分类号： G01L9/06
CPC分类号： G01L9/0042 , G01L9/0054
摘要： A gauge pressure sensor apparatus and a method of forming the same. A constraint wafer can be partially etched to set the diaphragm size, followed by bonding to a top wafer. The thickness of the top wafer is either the desired diaphragm thickness or is thinned to the desired thickness after bonding. The bonding of top wafer and constraint wafer enables electrochemical etch stopping. This allows the media conduit to be etched through the back of the constraint wafer and an electrical signal produced when the etching reaches the diaphragm. The process prevents the diaphragm from being over-etched. The invention allows the die size to be smaller than die where the diaphragm size is set by etching from the back side.
摘要翻译： 表压传感器装置及其形成方法。 可以部分地蚀刻约束晶片以设置膜片尺寸，然后粘结到顶部晶片。 顶部晶片的厚度是所需的隔膜厚度，或者在粘结后被减薄到所需的厚度。 顶部晶片和约束晶片的结合使得电化学蚀刻停止。 这允许介质管道被蚀刻通过约束晶片的背面和当蚀刻到达隔膜时产生的电信号。 该过程防止隔膜过度蚀刻。 本发明允许模具尺寸小于通过从背面蚀刻设置膜片尺寸的模具。
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7.发明授权Method to reduce die edge shorting on pressure sensors using conductive elastomeric seals 有权使用导电弹性体密封件减少压力传感器上的模头边缘短路的方法公开(公告)号：US07343812B2
公开(公告)日：2008-03-18
申请号：US11453509
申请日：2006-06-15
申请人： Carl E. Stewart , Richard A. Davis
发明人： Carl E. Stewart , Richard A. Davis
IPC分类号： G01L7/00
CPC分类号： G01L9/0042 , B81B2201/0264 , B81C1/00333
摘要： A pressure sensor includes a sensing element fabricated on an N-type epitaxial layer grown on a P-type substrate, a P-type isolation region located around the edge of the sensing element die and in contact with the P-type substrate, and a conductive elastomeric seal engaging the P-type isolation region prevents shorting of the conductive elastomeric seal with the N-type epitaxial layer of the sensing element die. A method of making a pressure sensor comprises growing an n-type epitaxy layer on a p-type substrate wafer, resulting in a pressure sensor die and substrate having an edge, obtaining a mask adapted for fabricating an isolation diffusion layer around the edge using P-type material, and creating an isolation layer diffusion using P-type doping material around the edge using the mask. A conductive elastomeric seal can then be placed over the sensor die to make electrical contact to the package.
摘要翻译： 压力传感器包括制造在P型衬底上生长的N型外延层上的感测元件，位于感测元件裸片的边缘周围并与P型衬底接触的P型隔离区，以及 接合P型隔离区域的导电弹性体密封件防止导电弹性体密封件与感测元件裸片的N型外延层短路。 一种制造压力传感器的方法包括在p型衬底晶片上生长n型外延层，从而产生具有边缘的压力传感器管芯和衬底，获得适于使用P制造围绕边缘的隔离扩散层的掩模 并使用掩模在边缘周围使用P型掺杂材料产生隔离层扩散。 然后可以将导电弹性体密封件放置在传感器管芯上方以与封装件电接触。
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8.发明申请Method to reduce die edge shorting on pressure sensors using conductive elastomeric seals 有权使用导电弹性体密封件减少压力传感器上的模头边缘短路的方法公开(公告)号：US20070289387A1
公开(公告)日：2007-12-20
申请号：US11453509
申请日：2006-06-15
申请人： Carl E. Stewart , Richard A. Davis
发明人： Carl E. Stewart , Richard A. Davis
IPC分类号： G01L9/00
CPC分类号： G01L9/0042 , B81B2201/0264 , B81C1/00333
摘要： A pressure sensor includes a sensing element fabricated on an N-type epitaxial layer grown on a P-type substrate, a P-type isolation region located around the edge of the sensing element die and in contact with the P-type substrate, and a conductive elastomeric seal engaging the P-type isolation region prevents shorting of the conductive elastomeric seal with the N-type epitaxial layer of the sensing element die. A method of making a pressure sensor comprises growing an n-type epitaxy layer on a p-type substrate wafer, resulting in a pressure sensor die and substrate having an edge, obtaining a mask adapted for fabricating an isolation diffusion layer around the edge using P-type material, and creating an isolation layer diffusion using P-type doping material around the edge using the mask. A conductive elastomeric seal can then be placed over the sensor die to make electrical contact to the package.
摘要翻译： 压力传感器包括制造在P型衬底上生长的N型外延层上的感测元件，位于感测元件裸片的边缘周围并与P型衬底接触的P型隔离区，以及 接合P型隔离区域的导电弹性体密封件防止导电弹性体密封件与感测元件裸片的N型外延层短路。 一种制造压力传感器的方法包括在p型衬底晶片上生长n型外延层，从而产生具有边缘的压力传感器管芯和衬底，获得适于使用P制造围绕边缘的隔离扩散层的掩模 并使用掩模在边缘周围使用P型掺杂材料产生隔离层扩散。 然后可以将导电弹性体密封件放置在传感器管芯上方以与封装件电接触。
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公开(公告)号：US20120235395A1
公开(公告)日：2012-09-20
申请号：US13488037
申请日：2012-06-04
申请人： Eric A. Davis , Brian P. Davis , Richard A. Davis
发明人： Eric A. Davis , Brian P. Davis , Richard A. Davis
IPC分类号： B60R7/00
CPC分类号： B62K19/46 , B60G3/06 , B60G3/20 , B60G7/001 , B60G11/15 , B60G2200/142 , B60G2200/144 , B60G2202/12 , B60G2202/24 , B60G2206/012 , B60G2206/10 , B60G2300/12 , B62D21/183 , B62D23/005 , B62D29/043 , B62K5/01 , Y10S180/908 , Y10T29/49622 , Y10T29/49826
摘要： Various embodiments of reduced-size vehicles such as all-terrain vehicles (ATVs) and utility vehicles (UVs) are disclosed herein. In at least some embodiments, the vehicles include frames that are wider near the front and rear sections of the vehicles than within the mid-sections of the vehicles. This, in combination with the use of shock-absorbers that are substantially vertically oriented, allows for the opening-up of large interior cavities within the front and rear sections of the vehicles within which can be positioned large front and rear internal compartments that can provide storage/carrying capacity as well as added buoyancy for the vehicle, among other things. Also, in at least some embodiments, the vehicles can include special cooling and/or exhaust systems having components that are positioned substantially within the mid-sections of the vehicles, thus further increasing the amounts of space available for the cavities/compartments within the front and rear sections of the vehicles.
摘要翻译： 本文公开了诸如全地形车辆（ATV）和多用途车辆（UV）等小型车辆的各种实施例。 在至少一些实施例中，车辆包括在车辆的前部和后部部分比在车辆的中间部分内更宽的框架。 这结合使用基本上垂直定向的减震器，允许在车辆的前部和后部中敞开大的内部空腔，在该内部空腔内可以定位大的前后内部隔室，其可以提供 存储/承载能力以及车辆的增加浮力等等。 而且，在至少一些实施例中，车辆可以包括特殊的冷却和/或排气系统，其具有基本上位于车辆的中间部分内的部件，从而进一步增加可用于前部空腔/隔间的空间量 和后部车辆。
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公开(公告)号：US08191930B2
公开(公告)日：2012-06-05
申请号：US13093404
申请日：2011-04-25
申请人： Eric A. Davis , Brian P. Davis , Richard A. Davis
发明人： Eric A. Davis , Brian P. Davis , Richard A. Davis
IPC分类号： B62D21/00
CPC分类号： B62K19/46 , B60G3/06 , B60G3/20 , B60G7/001 , B60G11/15 , B60G2200/142 , B60G2200/144 , B60G2202/12 , B60G2202/24 , B60G2206/012 , B60G2206/10 , B60G2300/12 , B62D21/183 , B62D23/005 , B62D29/043 , B62K5/01 , Y10S180/908 , Y10T29/49622 , Y10T29/49826
摘要： Various embodiments of reduced-size vehicles such as all-terrain vehicles (ATVs) and utility vehicles (UVs) are disclosed herein. In at least some embodiments, the vehicles include frames that are wider near the front and rear sections of the vehicles than within the mid-sections of the vehicles. This, in combination with the use of shock-absorbers that are substantially vertically oriented, allows for the opening-up of large interior cavities within the front and rear sections of the vehicles within which can be positioned large front and rear internal compartments that can provide storage/carrying capacity as well as added buoyancy for the vehicle, among other things. Also, in at least some embodiments, the vehicles can include special cooling and/or exhaust systems having components that are positioned substantially within the mid-sections of the vehicles, thus further increasing the amounts of space available for the cavities/compartments within the front and rear sections of the vehicles.
摘要翻译： 本文公开了诸如全地形车辆（ATV）和多用途车辆（UV）等小型车辆的各种实施例。 在至少一些实施例中，车辆包括在车辆的前部和后部部分比在车辆的中间部分内更宽的框架。 这结合使用基本上垂直定向的减震器，允许在车辆的前部和后部中敞开大的内部空腔，在该内部空腔内可以定位大的前后内部隔室，其可以提供 存储/承载能力以及车辆的增加浮力等等。 而且，在至少一些实施例中，车辆可以包括特殊的冷却和/或排气系统，其具有基本上位于车辆的中间部分内的部件，从而进一步增加可用于前部空腔/隔间的空间量 和后部车辆。
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