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公开(公告)号：US07798010B2
公开(公告)日：2010-09-21
申请号：US11973966
申请日：2007-10-11
IPC分类号： G01L1/00
CPC分类号： G01L19/146 , G01L19/04 , H01L2924/15151
摘要： The sensor geometry for improved package stress isolation is disclosed. A counterbore on the backing plate improves stress isolation properties of the sensor. The counterbore thins the wall of the backing plate maintaining the contact area with the package. The depth and diameter of the counterbore can be adjusted to find geometry for allowing the backing plate to absorb more package stresses. Thinning the wall of the backing plate make it less rigid and allows the backing plate to absorb more of the stresses produced at the interface with the package. The counterbore also keeps a large surface area at the bottom of the backing plate creating a strong bond with the package.
摘要翻译： 公开了用于改进封装应力隔离的传感器几何形状。 背板上的沉孔提高了传感器的应力隔离性能。 沉头孔沉浸在背板的壁上，保持与包装件的接触面积。 可以调节沉孔的深度和直径以找到允许背板吸收更多包装应力的几何形状。 使背板的壁变薄使其较不刚性，并且允许背板吸收在与封装的界面处产生的更多的应力。 沉孔还在背板的底部保持较大的表面积，从而与包装形成牢固的结合。
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公开(公告)号：US20090096040A1
公开(公告)日：2009-04-16
申请号：US11973966
申请日：2007-10-11
CPC分类号： G01L19/146 , G01L19/04 , H01L2924/15151
摘要： The sensor geometry for improved package stress isolation is disclosed. A counterbore on the backing plate improves stress isolation properties of the sensor. The counterbore thins the wall of the backing plate maintaining the contact area with the package. The depth and diameter of the counterbore can be adjusted to find geometry for allowing the backing plate to absorb more package stresses. Thinning the wall of the backing plate make it less rigid and allows the backing plate to absorb more of the stresses produced at the interface with the package. The counterbore also keeps a large surface area at the bottom of the backing plate creating a strong bond with the package.
摘要翻译： 公开了用于改进封装应力隔离的传感器几何形状。 背板上的沉孔提高了传感器的应力隔离性能。 沉头孔沉浸在背板的壁上，保持与包装件的接触面积。 可以调节沉孔的深度和直径以找到允许背板吸收更多包装应力的几何形状。 使背板的壁变薄使其较不刚性，并且允许背板吸收在与封装的界面处产生的更多的应力。 沉孔还在背板的底部保持较大的表面积，从而与包装形成牢固的结合。
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3.发明授权Small gauge pressure sensor using wafer bonding and electrochemical etch stopping 有权使用晶圆接合和电化学蚀刻停止的小型压力传感器公开(公告)号：US07493822B2
公开(公告)日：2009-02-24
申请号：US11825237
申请日：2007-07-05
IPC分类号： G01L9/06
CPC分类号： G01L9/0042 , G01L9/0054
摘要： A gauge pressure sensor apparatus and a method of forming the same. A constraint wafer can be partially etched to set the diaphragm size, followed by bonding to a top wafer. The thickness of the top wafer is either the desired diaphragm thickness or is thinned to the desired thickness after bonding. The bonding of top wafer and constraint wafer enables electrochemical etch stopping. This allows the media conduit to be etched through the back of the constraint wafer and an electrical signal produced when the etching reaches the diaphragm. The process prevents the diaphragm from being over-etched. The invention allows the die size to be smaller than die where the diaphragm size is set by etching from the back side.
摘要翻译： 表压传感器装置及其形成方法。 可以部分地蚀刻约束晶片以设置膜片尺寸，然后粘结到顶部晶片。 顶部晶片的厚度是所需的隔膜厚度，或者在粘结后被减薄到所需的厚度。 顶部晶片和约束晶片的结合使得电化学蚀刻停止。 这允许介质管道被蚀刻通过约束晶片的背面和当蚀刻到达隔膜时产生的电信号。 该过程防止隔膜过度蚀刻。 本发明允许模具尺寸小于通过从背面蚀刻设置膜片尺寸的模具。
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公开(公告)号：US08082798B2
公开(公告)日：2011-12-27
申请号：US12857380
申请日：2010-08-16
IPC分类号： G01L1/00
CPC分类号： G01L19/146 , G01L19/04 , H01L2924/15151
摘要： The sensor geometry for improved package stress isolation is disclosed. A counterbore on the backing plate improves stress isolation properties of the sensor. The counterbore thins the wall of the backing plate maintaining the contact area with the package. The depth and diameter of the counterbore can be adjusted to find geometry for allowing the backing plate to absorb more package stresses. Thinning the wall of the backing plate make it less rigid and allows the backing plate to absorb more of the stresses produced at the interface with the package. The counterbore also keeps a large surface area at the bottom of the backing plate creating a strong bond with the package.
摘要翻译： 公开了用于改进封装应力隔离的传感器几何形状。 背板上的沉孔提高了传感器的应力隔离性能。 沉头孔沉浸在背板的壁上，保持与包装件的接触面积。 可以调节沉孔的深度和直径以找到允许背板吸收更多包装应力的几何形状。 使背板的壁变薄使其较不刚性，并且允许背板吸收在与封装的界面处产生的更多的应力。 沉孔还在背板的底部保持较大的表面积，从而与包装形成牢固的结合。
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公开(公告)号：US20100301435A1
公开(公告)日：2010-12-02
申请号：US12857380
申请日：2010-08-16
CPC分类号： G01L19/146 , G01L19/04 , H01L2924/15151
摘要： The sensor geometry for improved package stress isolation is disclosed. A counterbore on the backing plate improves stress isolation properties of the sensor. The counterbore thins the wall of the backing plate maintaining the contact area with the package. The depth and diameter of the counterbore can be adjusted to find geometry for allowing the backing plate to absorb more package stresses. Thinning the wall of the backing plate make it less rigid and allows the backing plate to absorb more of the stresses produced at the interface with the package. The counterbore also keeps a large surface area at the bottom of the backing plate creating a strong bond with the package.
摘要翻译： 公开了用于改进封装应力隔离的传感器几何形状。 背板上的沉孔提高了传感器的应力隔离性能。 沉头孔沉浸在背板的壁上，保持与包装件的接触面积。 可以调节沉孔的深度和直径以找到允许背板吸收更多包装应力的几何形状。 使背板的壁变薄使其较不刚性，并且允许背板吸收在与封装的界面处产生的更多的应力。 沉孔还在背板的底部保持较大的表面积，从而与包装形成牢固的结合。
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6.发明申请SMALL GAUGE PRESSURE SENSOR USING WAFER BONDING AND ELECTROCHEMICAL ETCH STOPPING 有权小型压力传感器采用波峰焊和电化学灭弧公开(公告)号：US20090007681A1
公开(公告)日：2009-01-08
申请号：US11825237
申请日：2007-07-05
CPC分类号： G01L9/0042 , G01L9/0054
摘要： A gauge pressure sensor apparatus and a method of forming the same. A constraint wafer can be partially etched to set the diaphragm size, followed by bonding to a top wafer. The thickness of the top wafer is either the desired diaphragm thickness or is thinned to the desired thickness after bonding. The bonding of top wafer and constraint wafer enables electrochemical etch stopping. This allows the media conduit to be etched through the back of the constraint wafer and an electrical signal produced when the etching reaches the diaphragm. The process prevents the diaphragm from being over-etched. The invention allows the die size to be smaller than die where the diaphragm size is set by etching from the back side.
摘要翻译： 表压传感器装置及其形成方法。 可以部分地蚀刻约束晶片以设置膜片尺寸，然后粘结到顶部晶片。 顶部晶片的厚度是所需的隔膜厚度，或者在粘结后被减薄到所需的厚度。 顶部晶片和约束晶片的结合使得电化学蚀刻停止。 这允许介质管道被蚀刻通过约束晶片的背面和当蚀刻到达隔膜时产生的电信号。 该过程防止隔膜过度蚀刻。 本发明允许模具尺寸小于通过从背面蚀刻设置膜片尺寸的模具。
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公开(公告)号：US07216547B1
公开(公告)日：2007-05-15
申请号：US11328415
申请日：2006-01-06
申请人： Carl E. Stewart , Gilberto Morales
发明人： Carl E. Stewart , Gilberto Morales
IPC分类号： G01L7/00
CPC分类号： G01L9/0055 , G01L9/0042
摘要： A pressure sensor apparatus and method that incorporates a silicon frit bonded cap. The pressure sensor includes a silicon sensor wafer with diaphragms at a bottom surface thereof, a silicon cap wafer mounted on the topside of each sensor wafer, a plurality of silicon sensor die formed on the sensor wafer, a silicon cap wafer etched to create a plurality of reference cavities on the topside of the diaphragm, a thin glass frit to form a wafer-to-wafer bond between the sensor wafer and cap wafer. Sensing devices such as semiconductor die/sensor, peizoresistors, can be used to sense the pressure. The wafer-to-wafer frit bonding improves the output signal drift and the thermal performance of the pressure sensor minimizes the thermal mismatch created by anodic bonded glass wafers.
摘要翻译： 一种压力传感器装置和方法，其包括硅玻璃料接合盖。 压力传感器包括在其底表面上具有隔膜的硅传感器晶片，安装在每个传感器晶片顶部的硅盖晶片，形成在传感器晶片上的多个硅传感器管芯，被蚀刻以形成多个 的薄膜玻璃料，以在传感器晶片和盖子晶片之间形成晶片与晶片的结合。 可以使用诸如半导体管芯/传感器，传感器等感测装置感测压力。 晶圆到晶片的玻璃料粘合改善了输出信号漂移，并且压力传感器的热性能使由阳极粘合玻璃晶片产生的热失配最小化。
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公开(公告)号：US08297125B2
公开(公告)日：2012-10-30
申请号：US12126494
申请日：2008-05-23
CPC分类号： G01L9/0054 , G01L19/0038 , G01L19/147
摘要： A differential pressure sensor includes two pressure ports for allowing media to pass into contact with both the top and bottom sides of the diaphragm. A silicon pressure sensor die can be attached between the pressure ports using die attach materials for sensing a differential pressure between the media to evaluate media differential pressure. A cap with an opening can be placed on topside of a diaphragm formed in the silicon pressure die. The silicon pressure die can include die bond pads that can be electrically connected to the diaphragm to output electrical signals. The cap can seal the die bond pads from the harsh media and route the electrical signals therein. Media can pass through the opening in the cap such that a media path to the top of the diaphragm is not exposed to the die bond pads of the silicon pressure die to ensure long-term sensor reliability.
摘要翻译： 差压传感器包括两个压力端口，用于允许介质与隔膜的顶侧和底侧进行接触。 硅压力传感器模具可以使用管芯附接材料连接在压力端口之间，用于感测介质之间的压差以评估介质压差。 具有开口的盖可以放置在形成在硅压模中的隔膜的上侧。 硅压模可以包括可以与膜片电连接以输出电信号的管芯接合焊盘。 盖可以将密封焊盘从恶劣的介质密封并将电信号传送到其中。 介质可以穿过盖中的开口，使得到隔膜顶部的介质路径不暴露于硅压模的管芯接合焊盘，以确保长期的传感器可靠性。
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公开(公告)号：US07647842B1
公开(公告)日：2010-01-19
申请号：US12180070
申请日：2008-07-25
IPC分类号： G01F1/38
摘要： A volumetric fluid flow sensor (100) includes a flow channel (120) for flowing a fluid therein; and a diaphragm (110) having an outer surface within the flow channel (120). The diaphragm (110) includes at least one flow disrupting feature mechanically coupled to or emerging from the outer surface of the diaphragm (110). A sensing structure (126) is coupled to the diaphragm (110) for generating a sensing signal responsive to a pressure signal on the diaphragm (110).
摘要翻译： 体积流体流量传感器（100）包括用于在其中流动流体的流动通道（120） 以及在所述流动通道（120）内具有外表面的隔膜（110）。 隔膜（110）包括至少一个机械耦合到隔膜（110）的外表面或从隔膜的外表面出来的流动干扰特征。 感测结构（126）耦合到隔膜（110），用于响应于隔膜（110）上的压力信号产生感测信号。
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公开(公告)号：US20090288492A1
公开(公告)日：2009-11-26
申请号：US12126494
申请日：2008-05-23
CPC分类号： G01L9/0054 , G01L19/0038 , G01L19/147
摘要： A differential pressure sensor includes two pressure ports for allowing media to pass into contact with both the top and bottom sides of the diaphragm. A silicon pressure sensor die can be attached between the pressure ports using die attach materials for sensing a differential pressure between the media to evaluate media differential pressure. A cap with an opening can be placed on topside of a diaphragm formed in the silicon pressure die. The silicon pressure die can include die bond pads that can be electrically connected to the diaphragm to output electrical signals. The cap can seal the die bond pads from the harsh media and route the electrical signals therein. Media can pass through the opening in the cap such that a media path to the top of the diaphragm is not exposed to the die bond pads of the silicon pressure die to ensure long-term sensor reliability.
摘要翻译： 差压传感器包括两个压力端口，用于允许介质与隔膜的顶侧和底侧进行接触。 硅压力传感器模具可以使用管芯附接材料连接在压力端口之间，用于感测介质之间的压差以评估介质压差。 具有开口的盖可以放置在形成在硅压模中的隔膜的上侧。 硅压模可以包括可以与膜片电连接以输出电信号的管芯接合焊盘。 盖可以将密封焊盘从恶劣的介质密封并将电信号传送到其中。 介质可以穿过盖中的开口，使得到隔膜顶部的介质路径不暴露于硅压模的管芯接合焊盘，以确保长期的传感器可靠性。
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