A wafer/wafer translator pair in the attached state, with the wafer translator extending beyond the outer circumference of the wafer, is disposed on a rotation stage. At least one surface of the edge-extended wafer translator, in a peripheral annular region, provides contact pads electrically coupled to corresponding pads on the wafer, and a caliper-style contact block, operable to move perpendicularly the edge-extended wafer translator is positioned such the contact pads of the annular region may be electrically engaged with the contact block. After electrical communication between the wafer and the contact block, the contact block moves to a disengagement position, the rotation stage rotates the wafer/wafer translator pair to a new position and the contact block may then move into engagement with different contact pads in the annular region.